Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
M24SR64-YDW6T/2 是 STMicroelectronics(意法半导体)推出的一款高性能RFID应答器,专为在物联网和近场通信(NFC)应用中提供灵活、高效的无线数据传输而设计。该器件符合ISO 14443标准,工作频率为13.56MHz,设计用于能够处理多种数据传输需求的系统。凭借其宽电压范围和广泛的工作温度范围,M24SR64-YDW6T/2 被广泛应用于智能卡、电子标签以及随身物品管理等场合。
M24SR64-YDW6T/2 采用表面贴装型封装(TSSOP-8),其封装尺寸为0.173英寸(4.40mm宽),便于安装在空间有限的电路板中。该芯片支持I²C接口,使得与微控制器等外部设备的通信变得更加简单和高效。此外,其供电电压范围为2.7V至5.5V,能够适应多种应用场景下的供电要求。
M24SR64-YDW6T/2 的工作温度范围从-40°C到85°C。这一广泛的温度范围使得该器件能够在各种严酷的环境下稳定工作,非常适合工业、汽车、消费电子等领域的应用。其高温和低温的耐受性进一步增强了其在各种环境条件下的适应能力。
M24SR64-YDW6T/2 广泛应用于许多领域,包括但不限于:
M24SR64-YDW6T/2 的主要优势体现在以下几个方面:
总而言之,M24SR64-YDW6T/2 是一款功能强大、灵活性高的RFID应答器,适合多种现代应用的需求。从物联网到智能卡支付,其广泛的应用前景和强大的技术特性,使得该器件在市场上具备竞争优势。无论是在工业领域,还是在消费电子中,M24SR64-YDW6T/2 都展现出了其重要性和价值,成为设计工程师和产品开发者的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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