WMSIC Electronic Components

ST M24M01-DFMN6TP M24M01

ModelM24M01-DFMN6TP
PackageSO-8
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ST(STMicroelectronics) M24M01-DFMN6TP
Type
ST
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ST(STMicroelectronics)
Electronic Component
M24M01-DFMN6TP
Electronic Component
1
Package
SO-8
Electronic Component
EEPROM
Electronic Component
0.194g
Electronic Component
1
Features
Built-in positions(POR);; Built-in (ECC)
Electronic Component
BM0000281924
Electronic Component
1Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
400

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M24M01-DFMN6TP 产品概述

产品简介: M24M01-DFMN6TP 是由意法半导体(STMicroelectronics)生产的一款高性能 EEPROM 存储器,采用 I2C 接口设计,具有 1Mb(128K x 8)的存储容量。这款 EEPROM 具有非易失性,并能够在宽广的工作电压范围内可靠地工作,电压范围从 1.7V 到 5.5V。得益于其低功耗特性和出色的工作温度范围(-40°C 至 85°C),M24M01-DFMN6TP 特别适合用于工业控制、消费电子、智能家居等各种要求稳健性能的应用场景。

存储器特性: M24M01-DFMN6TP 的存储器构架基于 EEPROM 技术,能够在断电时保留数据,包括写入和读取操作。其基于 I2C 接口的设计使得这一型号能够与多种微控制器和处理器进行无缝通信,支持多种应用的集成工作。

性能参数: 设备的访问时间为 500ns,使得数据读取速度较快,能够有效提升系统响应性能。写周期时间(包括字写和页写)为 5ms,这使得在进行数据更新时,设备能够保持较高的效率。时钟频率可达到 1MHz,进一步增强了数据传输的速率。

工作电压与温度范围: M24M01-DFMN6TP 的工作电压范围宽广(1.7V ~ 5.5V),使其能在多种电源条件下运作,适应性强。同时,其工作温度范围为 -40°C 到 85°C,确保在极端温度环境下的稳定运行,极大地增强了该器件的应用场景,特别是面向工业和汽车电子领域。

封装设计: 该款 EEPROM 采用了 8-SOIC(Small Outline Integrated Circuit)封装形式,宽度为 3.90mm,便于表面贴装。这种封装类型可以有效节省 PCB 设计空间,同时简化了自动化生产过程,降低了生产成本。8-SO 封装的紧凑特性特别适合于具有空间限制的设备中。

应用领域: M24M01-DFMN6TP 的设计定位使其适用于多种市场应用,其中包括:

  • 工业自动化设备: 适用于数据记录和配置存储。
  • 消费电子产品: 广泛应用于个人电子设备(如智能手机、平板电脑等)中的设置存储。
  • 汽车电子: 能够在汽车控制单元等关键部位执行数据存储任务。
  • 物联网设备: 作为传感器/执行器的非易失存储解决方案,用于存储设备配置和历史数据。

优势与总结: M24M01-DFMN6TP EEPROM 在稳定性、低功耗和广泛的工作条件下表现出色,使其成为多个行业应用的理想选择。由意法半导体制造,意味着该产品拥有可靠的质量保证和技术支持,能够满足客户对数据存储的严苛要求。通过对性能、结构和应用场景的深刻理解,M24M01-DFMN6TP 必将推动智能化、自动化设备的进一步发展,助力未来技术革新。

在选择 EEPROM 解决方案时,M24M01-DFMN6TP 无疑是一个非常优秀的选择,凭借其先进的性能和灵活的应用能力,可以帮助工程师在多种复杂环境下实现高效且可靠的数据存储与管理。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.