WMSIC Electronic Components

Sunlord SDCL0603Q6N8HT02B03

ModelSDCL0603Q6N8HT02B03
Package0201
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL0603Q6N8HT02B03
Type
SUNLORD
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL0603Q6N8HT02B03
Electronic Component
1
Package
0201
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.009g
Inductor
6.8nH
Electronic Component
1
Factor
13@500MHz
Electronic Component
BM0264079963
Current
300mA
Frequency
5.5GHz
Resistor(DCR)
500mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDCL0603Q6N8HT02B03 产品概述

一、产品简介

SDCL0603Q6N8HT02B03(顺络 Sunlord)是一款高精度贴片电感,额定电感值为 6.8 nH,公差 ±3%,额定直流电流 300 mA,直流电阻(DCR)典型值为 500 mΩ。该器件为 0201 超小封装,品质因数 Q = 13(测试频点 500 MHz),自谐振频率(SRF)高达 5.5 GHz,适用于高频射频匹配、滤波和抑制电磁干扰的紧凑电路设计。

二、主要电气参数

  • 电感值:6.8 nH ±3%
  • 额定电流:300 mA(持续直流额定)
  • 直流电阻(DCR):约 500 mΩ
  • 品质因数(Q):13 @ 500 MHz(测试条件下)
  • 自谐振频率(SRF):5.5 GHz
  • 封装:0201(超小型,适合高密度贴装)

三、特性与优势

  • 精密公差(±3%),适合对电感值稳定性要求较高的射频与高频电路。
  • 超小封装(0201),有利于降低 PCB 占用面积,实现高密度布局与小型化产品设计。
  • 较高的 SRF(5.5 GHz)允许在 GHz 级频段内工作,适用于滤波、匹配与阻抗调节等场景。
  • Q 值表现良好(13@500MHz),在中高频段具有较低损耗特性。

四、典型应用

  • 射频前端匹配网络(天线匹配、滤波器网路)
  • 高速信号链的阻抗调节、去耦与旁路(需要注意电感值与频段匹配)
  • EMI/EMC 抑制元件,用于抑制共模/差模干扰(结合其他元件设计)
  • 小型化便携设备、无线通信模块、蓝牙/Wi‑Fi/5G 子系统等空间受限场合

五、封装与 PCB 布局建议

  • 0201 封装体积极小,典型尺寸约 0.6 mm × 0.3 mm(请以厂方数据手册为准),焊盘设计应控制焊膏量与过焊,以免影响贴片质量。
  • 布局时尽量缩短与相邻器件的信号走线,避免长走线带来寄生电感/电容。
  • 对于射频应用,考虑阻抗变换与地平面完整性,必要时在电感两端做微带线仿真校核。
  • 采用标准回流焊工艺,遵循厂商推荐的温度曲线,避免过热或机械应力导致性能退化。

六、选型与使用注意事项

  • 直流电阻 500 mΩ 较高,通流时会有一定功耗与温升,实际应用中应留有余量,建议在额定电流以下使用并验证温升与电感漂移。
  • 高频性能(Q、SRF)受器件布局、焊盘及周围介质影响,射频设计需结合仿真与实测确认。
  • 如果电路有直流偏置或较大交直流混合电流,需关注电感在偏置下的线性与饱和特性。
  • 对可靠性要求高的产品,建议参考顺络的环境与寿命测试规范(如高温存储、热循环、潮热测试等)。

本概述基于给定的关键参数编写,实际设计时请参照顺络官方数据手册以获取完整的封装尺寸、曲线特性及可靠性测试数据。

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