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顺络SDCL0603QR12JT02B03是一款针对高频小型化电路设计的0201(英制)/0603(公制)封装贴片电感,凭借精准的电性能、稳定的损耗特性及紧凑的体积,适配ISM频段无线通信、蓝牙模块等场景的射频匹配需求。
该电感采用0201英制贴片封装(公制尺寸0.6mm×0.3mm),体积仅为传统插件电感的1/5左右,可满足高密度贴装设计要求,有效降低终端产品的空间占用。封装结构为顺络成熟的陶瓷基绕线工艺,兼具耐温性(支持260℃回流焊)与机械强度,且符合RoHS 2.0、REACH等环保指令,无铅无卤,适配全球市场合规需求。
电感标称值为120nH,精度控制在**±5%** 范围内,属于高频电感领域的可靠精度等级。该精度可避免因电感偏差导致的射频信号频率偏移,确保电路匹配一致性,适配对电感值稳定性要求较高的射频前端设计。
Q值为9@300MHz,是衡量电感储能与损耗比的核心指标。300MHz为ISM频段(315MHz、433MHz)的临近频率,该Q值可有效降低电感在高频下的能量损耗,提升射频信号的传输效率,减少信号失真与杂散干扰。
自谐振频率为1GHz,即电感与自身寄生电容谐振的频率点。当工作频率低于1GHz时,电感呈现感性特性;超过1GHz则转为容性。实际应用中需确保工作频率远低于1GHz(如300MHz以内),以维持电感的感性功能稳定,避免特性突变影响电路性能。
SDCL0603QR12JT02B03针对高频小电流电路优化,典型应用包括:
顺络作为国内电感制造龙头,该系列电感具备以下可靠性保障:
该电感凭借紧凑体积、稳定电性能及可靠工艺,成为高频小型化电路的优选无源器件之一。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
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