Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord GZ1005D102CTF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord GZ1005D102CTF
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- GZ1005D102CTF
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0258490600
- Operating Temperature
- 55℃~+125℃
- Current
- 150mA
- @Frequency
- 1kΩ@100MHz
- Resistor(DCR)
- 700mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GZ1005D102CTF 产品概述
一、主要参数
GZ1005D102CTF（Sunlord / 顺络，0402 封装）为单通道铁氧体磁珠，关键电气与环境参数如下：
- 阻抗：1 kΩ @ 100 MHz（典型值）
- 阻抗误差：±25%
- 直流电阻（DCR）：约 700 mΩ
- 额定电流：150 mA
- 通道数：1
- 封装：0402（1005公制，约 1.0 × 0.5 mm）
- 工作温度：-55 ℃ ~ +125 ℃
二、器件特性与用途
该磁珠在 100 MHz 附近具有较高阻抗，适合抑制电源与信号线上高频干扰，常用于移动设备、物联网模块、射频前端电源去耦、USB/高速接口滤波及敏感模拟电路的共模/差模噪声抑制。0402 小尺寸有利于空间受限的 PCB 布局，但额定电流限制需注意。
三、设计与选型建议
- 布局位置：尽量靠近噪声源或被保护的 IC 引脚放置（如电源引脚、晶振供电或高速收发器输入端），以减小寄生走线引入的干扰。
- 电流与温升：150 mA 为器件额定电流，若实际工况接近或超过该值，应考虑并联多颗器件或改用更大封装以避免过热与阻抗下降。长期工作时应考虑环境温度对电流承载能力的影响。
- 滤波方案：单颗磁珠适合作为简单串联滤波元件；与旁路电容配合可构成低成本的 PI 或 T 型滤波网络，针对不同频段进行优化。
- 多颗串联/并联：若需更高阻抗可串联若干磁珠；若需更大通过电流可并联，但并联会影响高频特性，应在板级实验验证。
四、焊接与可靠性注意
- 焊接工艺：0402 为常见贴片件，请遵循厂商推荐的回流焊温度曲线与 IPC 焊接规范。避免过高峰值温度和过长保温时间以防组件性能退化或机械损伤。
- 机械可靠性：小型封装对焊盘设计与铺铜应谨慎处理，避免热应力与机械应力导致裂纹。保持焊盘对称并控制阻焊开窗。
- 环境与寿命：工作温度范围 -55 ℃ 至 +125 ℃，在高温、高湿或振动环境中应评估长期可靠性，必要时进行加速寿命测试。
五、测试与验证要点
- 测试阻抗曲线：除标称 100 MHz 阻抗外，应测量宽频带（如 MHz 至 GHz）阻抗曲线以确定在目标干扰频段的实际抑制效果。
- DCR 与电流测试：在目标电流条件下测量压降与自热，确认不会因热升导致阻抗显著变化或器件失效。
- EMI 验证：在系统原型上进行辐射与传导干扰测试，验证磁珠与滤波网络的实际抑制效果，并根据测试结果调整布局或元件参数。
总结：GZ1005D102CTF 为小型0402磁珠，提供在 100 MHz 附近较高阻抗，适用于对空间与成本敏感的 EMI 抑制场合。选型时需综合考虑额定电流、工作温度与 PCB 布局，必要时在系统层面做热与电性能验证。若需更详细的回流曲线、频率响应曲线或可靠性数据，请参考顺络官方数据手册或联系供应商获取完整技术规格表。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
