WMSIC Electronic Components

Sunlord SDCL0603Q10NHT02B03

ModelSDCL0603Q10NHT02B03
Package0201
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL0603Q10NHT02B03
Type
SUNLORD
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL0603Q10NHT02B03
Electronic Component
1
Package
0201
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.009g
Inductor
10nH
Electronic Component
1
Factor
13@500MHz
Electronic Component
BM0264536419
Current
250mA
Frequency
3.8GHz
Resistor(DCR)
700mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDCL0603Q10NHT02B03 贴片电感产品概述

SDCL0603Q10NHT02B03是顺络电子(Sunlord)推出的一款高性能0201封装贴片电感,专为高频电子设备的小型化、低功耗设计需求打造,广泛应用于射频通信、便携式电子及物联网终端等领域。

一、产品基本信息

  • 品牌与型号:顺络电子(Sunlord),型号SDCL0603Q10NHT02B03;
  • 封装形式:0201贴片封装(行业标准尺寸约0.6mm×0.3mm×0.3mm),适配表面贴装工艺;
  • 产品定位:高频小功率贴片电感,兼顾小型化与电气性能稳定性,适合高密度集成场景。

二、核心电气参数

该电感的关键参数经过优化,满足高频应用的核心需求:

  1. 电感值与精度:标称电感量10nH,精度±3%,可稳定匹配多数射频电路对电感量的控制要求;
  2. 额定电流:最大直流额定电流250mA,适配低功耗电子设备的电流承载需求;
  3. 直流电阻(DCR):700mΩ,在0201小封装下实现低损耗设计,减少电路功耗;
  4. 品质因数(Q值):13@500MHz,反映电感储能与损耗的比值,高频下仍保持良好能量效率;
  5. 自谐振频率(SRF):3.8GHz,是电感寄生电容与电感量的谐振频率点,工作频率需低于此值以保证电感特性稳定。

三、封装与工艺特性

  1. 小型化设计:0201封装尺寸紧凑,可显著节省PCB布局空间,适配便携式设备、小型模块的高密度集成需求;
  2. 焊接兼容性:支持回流焊、波峰焊等主流表面贴装工艺,焊接可靠性符合电子行业标准;
  3. 材料与结构:采用顺络自主研发的高性能磁性材料,结构紧凑,抗机械应力能力强,适合批量生产与长期使用。

四、典型应用场景

基于高频性能与小型化优势,该电感主要应用于:

  1. 射频通信设备:蓝牙(2.4GHz)、WiFi(2.4GHz/5GHz)模块的射频前端滤波、阻抗匹配电路;
  2. 便携式电子:智能手机、平板电脑、智能手表的射频子系统,满足小型化与低功耗需求;
  3. 物联网(IoT)终端:低功耗广域网(LPWAN)设备、智能传感器的信号调理电路;
  4. 高频滤波电路:射频信号的谐波抑制、电磁干扰(EMI)滤波;
  5. 匹配网络:射频放大器、天线的阻抗匹配,提升信号传输效率。

五、产品优势

  1. 高频性能优异:500MHz频段Q值达13,有效减少射频电路信号损耗;
  2. 精度稳定:±3%的电感精度,降低电路设计调试难度;
  3. 低损耗设计:700mΩ的DCR,在小封装下实现低功耗,延长电池续航;
  4. 可靠性高:顺络成熟工艺保障,产品一致性好,适合工业级与消费级应用;
  5. 集成度高:0201封装适配高密度PCB设计,助力设备小型化升级。

六、使用注意事项

  1. 电流限制:工作直流电流不得超过250mA,避免电感磁饱和导致性能下降;
  2. 频率范围:建议工作频率低于3.8GHz(自谐振频率),若需在谐振点附近使用,需通过电路设计补偿特性变化;
  3. 焊接规范:遵循0201封装焊接温度曲线,避免过热导致电感性能劣化;
  4. 存储条件:未焊接产品需存储于温度-40℃~85℃、湿度≤60%的环境中,避免受潮。

这款电感凭借平衡的电气性能与小型化设计,成为射频电子设备小型化升级的理想选择,可满足不同应用场景对高频电感的核心需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.