WMSIC Electronic Components

Sunlord SDCL0603Q4N7ST02B03

ModelSDCL0603Q4N7ST02B03
Package0201
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL0603Q4N7ST02B03
Type
SUNLORD
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL0603Q4N7ST02B03
Electronic Component
1
Package
0201
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.009g
Inductor
4.7nH
Electronic Component
1
Factor
13@500MHz
Electronic Component
BM0264913666
Current
350mA
Frequency
6.2GHz
Resistor(DCR)
400mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

顺络SDCL0603Q4N7ST02B03叠层贴片电感产品概述

一、产品基本属性与品牌背景

SDCL0603Q4N7ST02B03是顺络电子(Sunlord)推出的一款高频叠层贴片电感,属于公司射频电感系列核心产品。型号中,0603对应英制0201封装(公制尺寸0.6mm×0.3mm),Q4N7明确电感值为4.7nH,ST02B03为产品系列标识。顺络作为国内电感领域龙头企业,该产品延续了其叠层电感的高一致性、高可靠性特点,广泛适配消费电子、物联网等高频应用场景。

二、核心电气性能参数详解

该产品针对高频小电流应用优化,关键参数及意义如下:

  1. 电感值:4.7nH(常规公差±5%),属于高频小电感范畴,适配射频电路的阻抗匹配、滤波或谐振回路需求;
  2. 额定电流:350mA(直流),可满足大多数便携设备射频模块的偏置电流需求,避免电感饱和导致性能下降;
  3. 直流电阻(DCR):400mΩ,低电阻设计减少直流功率损耗,有助于降低电路发热,提升小电流场景下的效率;
  4. 品质因数(Q值):13@500MHz,Q值反映电感储能与损耗的比值,13在0201封装电感中处于中上游水平,适合谐振、滤波等对Q值敏感的应用;
  5. 自谐振频率(SRF):6.2GHz,自谐振点是电感由感性转为容性的临界频率,6.2GHz的SRF覆盖了蓝牙(2.4GHz)、WiFi(2.4/5GHz)、5G sub-6GHz等主流高频频段,高频性能突出。

三、封装与物理特性

该产品采用0201贴片封装(公制0603),典型尺寸为0.6mm×0.3mm×0.3mm,是当前最小的电感封装之一,可显著提升PCB布局密度,适配智能手机、TWS耳机等便携设备的狭小空间。叠层结构设计带来三大优势:

  • 电感一致性好:批量生产时参数波动小,适配量产需求;
  • 抗振动性能强:无引线设计减少寄生参数,同时耐冲击、抗振动,适合移动设备严苛环境;
  • 温漂特性稳定:叠层工艺使电感值温漂控制在±10%以内(-40℃~+85℃),满足宽温环境应用。

四、典型应用场景

结合产品参数与封装特点,核心应用场景包括:

  1. 便携电子射频前端:TWS蓝牙耳机、智能手表、智能手机的2.4GHz/5GHz射频匹配网络、滤波电路;
  2. 物联网(IoT)设备:低功耗射频模块(ZigBee、LoRa)的电感元件,满足小电流、小体积需求;
  3. 5G sub-6GHz电路:5G手机、基站小型化模块的阻抗匹配、谐振回路;
  4. 高频信号处理:GPS模块、无线充电辅助电路的滤波电感。

五、产品优势与选型参考

该产品的核心优势与选型匹配点如下:

  • 高频性能突出:SRF 6.2GHz+Q值13@500MHz,覆盖主流射频频段,适合GHz级应用;
  • 小体积高集成:0201封装适配高密度PCB,解决便携设备空间限制;
  • 低损耗设计:400mΩ DCR减少功率损耗,延长电池续航(针对便携设备);
  • 可靠性高:叠层结构抗振动,满足消费电子量产与使用环境;
  • 选型注意:工作电流需控制在350mA以内,工作频率建议低于6.2GHz(避免容性效应),PCB焊盘需匹配0201封装尺寸。

该产品凭借高频性能、小体积与可靠性,成为消费电子、物联网等领域射频电路的优选电感元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.