WMSIC Electronic Components

Sunlord GZ1005D121CTF

ModelGZ1005D121CTF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord GZ1005D121CTF
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
GZ1005D121CTF
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.019g
Electronic Component
1
Channel Count
1
Electronic Component
BM0227489110
Operating Temperature
55℃~+125℃
Current
400mA
@Frequency
120Ω@100MHz
Resistor(DCR)
180mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GZ1005D121CTF 产品概述

GZ1005D121CTF 是顺络(Sunlord)面向微型电子设备推出的一款单通道贴片磁珠(ferrite bead),封装为0402(公制 1005,尺寸约 1.0 × 0.5 mm)。该器件主要用于对电源线或信号线的高频噪声抑制,具有优良的频率响应特性和较低的直流电阻,适合空间受限且对电磁兼容(EMC)要求较高的便携式终端、物联网模组、消费电子及汽车电子等应用场景。

一、主要技术参数

  • 阻抗:120 Ω @ 100 MHz
  • 直流电阻(DCR):0.18 Ω(180 mΩ)
  • 额定电流:400 mA(持续工作电流)
  • 温度范围:-55 ℃ ~ +125 ℃
  • 通道数:1(单通道、串联使用)
  • 阻抗公差/制造偏差:±25%
  • 封装尺寸:0402(1005公制,约 1.0 × 0.5 mm)
  • 描述:磁珠 120 Ω@100 MHz,DCR 180 mΩ,额定电流 400 mA

二、产品特点

  • 高频抑制性能好:在 100 MHz 附近阻抗达到 120 Ω,能有效衰减高频干扰,改善 EMI 性能。
  • 低直流压降:DCR 仅 180 mΩ,减少供电线路压降与发热,适合低电压、小电流系统。
  • 宽工作温度:-55 ℃ 至 +125 ℃,适应工业级及车规级工作环境(请依据最终产品可靠性要求选型)。
  • 小型化封装:0402 尺寸利于高密度 PCB 布局,适合空间受限的便携设备。
  • 单通道设计:适用于单线的串联滤波或噪声隔离。

三、典型应用场景

  • 移动通信设备(手机、平板)电源/信号线 EMI 抑制
  • 无线模块、蓝牙/Wi‑Fi 天线引线的干扰抑制(串联应用)
  • 物联网、可穿戴设备的电源噪声滤波
  • 摄像机、传感器模组的数字电路与模拟电路之间的干扰隔离
  • 汽车信息娱乐系统与辅助电子子系统(依据系统电流与可靠性要求)

四、选型与使用建议

  • 电流与压降:额定电流 400 mA 为持续工作参考,若线路存在峰值或冲击电流,应考虑余量或并联多只/选用额定电流更高型号以避免过热或失效。
  • 频率特性匹配:磁珠的抑制效果随频率变化明显,若目标噪声频段与 100 MHz 相近,GZ1005D121CTF 是合适选择;对更高或更低频段需求,可参照顺络系列其它规格。
  • DCR 与系统性能:DCR 影响电源效率与热耗散,系统电压较低时应优先考虑低 DCR 器件。
  • 布局位置:建议将磁珠放置在噪声源与敏感电路之间或靠近 PCB 的电源入口/连接器处,连线尽量短并配合旁路/去耦电容构成完整滤波网络。
  • 温升与散热:在高平均功耗应用中,注意评估器件温升并留出热裕度,必要时选用更大封装或改进散热设计。

五、封装与焊接

  • 封装:0402(1005),适合标准 SMT 工艺。
  • 焊接工艺:兼容无铅回流焊流程,建议按 PCB 制造与组装的标准回流曲线进行,避免过长高温暴露以维持可靠性。具体回流参数请参考顺络出厂数据手册或与组装厂确认。
  • 储存与搬运:小尺寸器件易损伤,存储应避免潮湿与强机械应力;若为潮湿敏感器件(MSL),请按照供应商包装说明进行回烘处理。

六、可靠性与测试

  • 建议在产品验证阶段进行实际电流、温度和频谱测试,验证在目标工作条件下阻抗曲线与发热情况。
  • 常见可靠性试验包括温度循环、恒定加速老化、热冲击与焊接可靠性(焊锡热应力)测试,确保长期工作稳定性。

七、包装与订货信息

  • 型号:GZ1005D121CTF(建议在采购前向顺络确认型号含义及包装形式)
  • 包装形式:常见为卷带(Tape & Reel),适合高速贴片机自动贴装;如需散盘或其它包装形式,请与供应商确认。
  • 备注:在批量采购前建议索取样品并对关键参数(阻抗曲线、DCR、温升)进行验证。

如需更详细的阻抗频率曲线、焊接曲线或 PCB 参考封装(land pattern),建议参考顺络官方数据手册或提供具体使用场景以便进一步给出优化建议。

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