Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord SDCL0603Q2N7BT02B03
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDCL0603Q2N7BT02B03
- Type
- SUNLORD
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL0603Q2N7BT02B03
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 2.7nH
- Electronic Component
- 1
- Factor
- 13@500MHz
- Electronic Component
- BM0258491035
- Current
- 500mA
- Frequency
- 10GHz
- Resistor(DCR)
- 200mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL0603Q2N7BT02B03 产品概述
一、主要参数与型号说明
SDCL0603Q2N7BT02B03（顺络 Sunlord）为0201尺寸的叠层片式电感，电感值为2.7 nH，额定直流电流（Isat/额定电流）500 mA，直流电阻（DCR）约200 mΩ，品质因数Q=13（@500 MHz），自谐振频率（SRF）约10 GHz。封装为0201（0603/英制标称），适用于对体积和寄生参数要求严格的射频及高速电路。
二、产品特性
- 小型化：0201封装，适合高度集成和空间受限的移动终端、模块化产品。
- 高频性能：Q值较高且SRF高达10 GHz，适合GHz级别的匹配与滤波应用。
- 低电流规格：500 mA额定电流适用于射频前端、小信号滤波和去耦，而非大电流电源线用途。
- 叠层结构：稳定性好，温漂和机械强度较优，便于批量贴装。
三、典型应用场景
- 射频匹配网络与带通/带阻滤波器中的串联/并联元件。
- 无线通信设备（Wi‑Fi、蓝牙、LTE/5G前端）的小型匹配和谐振电路。
- 高频去耦、串联阻抗调节及高速差分链路的离散阻抗调节。
- 高频抗干扰与EMI抑制元件。
四、选型与注意事项
- 频率覆盖：工作频率应显著低于SRF（10 GHz）以保证电感性行为与Q值表现。
- 电流裕量：实际电路中考虑峰值与纹波电流，若超过500 mA应选用更大电流等级。
- DCR与损耗：200 mΩ DCR在射频应用会带来一定插入损耗，需评估系统增益预算。
- 温升与热管理：0201体积小，连续高电流或密集布局时需关注温升与热循环可靠性。
五、焊接与封装建议
- 推荐采用卷带盘（Tape & Reel）配合自动贴片机作业，使用适配0201的吸嘴。
- 回流焊温度曲线应遵循供应商推荐的峰值温度与坡度，避免过冲导致机械应力。
- 焊盘设计应参照厂商推荐脚位尺寸，保证可靠焊接并降低焊球裂纹风险。
- 贴装和后焊清洗过程中避免剧烈机械碰撞，以防微裂或性能漂移。
六、可靠性与测试
常见可靠性验证包括高低温循环、湿热试验、机械振动与落球测试以及焊接热稳性检测。出于性能一致性考虑，建议在量产前依据实际工艺进行预先样件评估（含频域S参数、直流电阻与温升测试），并参照顺络提供的详细Datasheet与可靠性数据进行最终确认。
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