WMSIC Electronic Components

Sunlord GZ1005U700TF

ModelGZ1005U700TF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord GZ1005U700TF
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
GZ1005U700TF
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.019g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264981170
Operating Temperature
55℃~+125℃
Current
200mA
@Frequency
70Ω@100MHz
Resistor(DCR)
300mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Sunlord GZ1005U700TF 0402封装磁珠产品概述

一、产品基本属性

Sunlord GZ1005U700TF是一款多层片式磁珠,核心设计围绕高频噪声抑制展开,适配高密度PCB布局需求。其型号命名包含明确的规格标识:

  • 1005对应公制封装尺寸(1.0mm×0.5mm),即英制0402封装;
  • 700代表100MHz频率下阻抗为70Ω;
  • TF为顺络内部封装/性能等级标识,确保批量一致性。

产品为单通道设计,无极性,适合单路信号或电源回路的噪声滤波,是小型化电子设备的常用基础元件。

二、核心性能参数解析

磁珠的关键价值在于「特定频率下的阻抗表现」与「直流损耗控制」,该型号核心参数如下:

1. 阻抗特性

  • 标称阻抗:70Ω@100MHz,偏差±25%(即实际阻抗范围52.5Ω~87.5Ω);
  • 应用意义:100MHz是高速数字信号(如DDR、USB3.0)、开关电源噪声的典型频率段,该阻抗值可有效抑制此频段的共模/差模干扰,且不影响低频信号传输。

2. 直流电阻(DCR)

  • 标称值:300mΩ;
  • 优势:低直流损耗,可忽略对电路直流供电(如5V/3.3V电源)或低速信号(如I2C、UART)的压降影响,适配对直流效率敏感的场景。

3. 额定电流与温度范围

  • 额定电流:200mA(持续工作电流上限);
  • 工作温度:-55℃~+125℃(宽温特性);
  • 注意:若电路峰值电流超过200mA,需参考顺络降额曲线(通常建议峰值电流≤300mA),宽温范围满足工业控制、汽车电子(部分场景)等严苛环境需求。

4. 封装尺寸

  • 0402封装(1.0mm×0.5mm×0.5mm):体积小、重量轻,适配智能手机、智能穿戴、小型工业控制器等高密度PCB设计。

三、典型应用场景

该磁珠的性能匹配多类小型化电子设备的噪声抑制需求,核心应用场景包括:

1. 高速数字接口滤波

  • 场景:DDR3/DDR4内存总线、USB3.0/3.1接口、HDMI2.0等;
  • 作用:抑制100MHz左右的信号串扰与电磁干扰(EMI),提升数据传输稳定性。

2. 低功耗射频模块滤波

  • 场景:蓝牙5.0、WiFi 2.4G频段的前端电路、低功耗LoRa模块;
  • 作用:滤除射频信号中的低频干扰,避免噪声影响信号收发灵敏度。

3. 小型电源滤波

  • 场景:5V/1A以下的开关电源输出、电池供电电路的噪声抑制;
  • 作用:削弱开关电源的高频纹波(开关频率常为几十~几百MHz),提升电源纯净度。

4. 工业控制与车载辅助电路

  • 场景:传感器接口(如温度、压力传感器)、小型PLC的输入输出回路;
  • 作用:宽温特性适配工业现场(-40℃~+85℃)或车载低温环境,抑制电磁干扰。

四、选型与使用注意事项

为确保性能稳定,需结合应用场景注意以下要点:

1. 频率匹配校验

若干扰频率偏离100MHz(如低于50MHz或高于200MHz),需选择对应频率下阻抗匹配的磁珠(如顺络GZ1005U500TF<50Ω@100MHz>、GZ1005U101TF<100Ω@100MHz>)。

2. 电流与温区确认

  • 持续工作电流需≤200mA,避免磁珠过热饱和(饱和后阻抗急剧下降,失去滤波作用);
  • 若环境温度超过125℃或低于-55℃,需更换宽温更宽的型号(如顺络AEC-Q200认证的车载级磁珠)。

3. PCB焊盘设计

参考顺络 datasheet 推荐焊盘尺寸(0.6mm×0.3mm),避免焊盘过大导致焊接应力集中,或过小引发虚焊。

4. 并联/串联规则

  • 并联:同型号并联可提升额定电流(如2个并联→400mA),但阻抗略有下降;
  • 串联:同型号串联可提升阻抗(如2个串联→约140Ω@100MHz),但需注意直流电阻叠加。

五、品牌与可靠性优势

Sunlord(顺络电子)作为国内片式磁珠龙头企业,该型号具备以下可靠性保障:

  • 环保认证:符合RoHS、REACH标准,无铅焊接兼容;
  • 工艺一致性:采用多层共烧陶瓷(MLCC)工艺,批量阻抗偏差控制在±25%以内;
  • 可靠性测试:通过高温存储(125℃/1000h)、温度循环(-55℃~+125℃/1000次)、焊接热冲击等测试,满足工业级应用要求。

综上,Sunlord GZ1005U700TF是一款小体积、宽温、低损耗的高频噪声抑制元件,适配多类小型化电子设备的滤波需求,是工程设计中高频噪声抑制的常用选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.