WMSIC Electronic Components

Sunlord SDNT1005X104J4250FTF

ModelSDNT1005X104J4250FTF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDNT1005X104J4250FTF
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDNT1005X104J4250FTF
Electronic Component
1
Electronic Component
0.5mm
Package
0402
Electronic Component
NTCThermistor Resistor
Electronic Component
0.019g
Electronic Component
1mm
Electronic Component
100kΩ
Electronic Component
0.5mm
Electronic Component
1
B
±1%
Electronic Component
BM0264913833
Operating Temperature
55℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDNT1005X104J4250FTF — Sunlord 0402 100KΩ NTC 热敏电阻 产品概述

一、产品简介

SDNT1005X104J4250FTF 为 Sunlord(顺络)生产的 0402 封装 NTC 热敏电阻,标称阻值 100kΩ,阻值公差 ±5%,B 值(25℃/50℃)= 4250K,B 值精度 ±1%。器件尺寸微小,适用于对体积及响应速度有较高要求的小型电子设备温度检测与补偿场合。

二、主要参数

  • 标称功率:100 mW(标称值,需按热性能与工作条件判断长期允许功耗)
  • 阻值:100 kΩ ±5%
  • B 值(25℃/50℃):4250 K,精度 ±1%
  • 最大稳态电流(25℃):100 μA(长期稳态限值)
  • 耗散系数(热阻反比):1 mW/℃(表示每 mW 自加热约引起 1℃ 升温)
  • 热时间常数:3 s(热响应较快)
  • 工作温度:-55℃ ~ +125℃
  • 尺寸:1.0 mm × 0.5 mm × 0.5 mm(0402)

注:基于最大稳态电流 100 μA,在 100 kΩ 时对应最高电压约 10 V,稳态功耗约 1 mW,应以此作为长期应用参考,避免仅以标称“功率 100 mW”作为持续工作依据。

三、产品特性与优势

  • 小尺寸(0402)适配高密度 SMT 设计,节省 PCB 面积;
  • 高 B 值(4250K)带来在低温区较高的灵敏度,利于精确温度检测;
  • B 值与阻值公差控制良好,适合要求温度精度与匹配性的传感/补偿电路;
  • 快速热响应(τ≈3 s),适合近场温度监测与短时变化响应。

四、典型应用

  • 智能手机、可穿戴、物联网终端的温度检测与温度补偿;
  • 电池管理系统(BMS)温度监测;
  • 热敏校准与温度保护电路;
  • 精密模拟电路、时钟晶振等需要温度补偿的场合。

五、设计与热管理建议

  • 避免长期在最大瞬时功率下工作;以最大稳态电流限制计算的约 1 mW 稳态功耗为长期参考;
  • 如需在高功耗或快速变化环境下使用,增加散热路径或减小工作电流以减少自发热误差;
  • 放置位置尽量靠近待测点,且远离大功率热源以降低寄生热耦合影响。

六、装配与测试注意事项

  • 采用常规 0402 SMT 回流工艺,注意回流曲线与峰值温度符合顺络推荐;
  • 测量时采用低测量电流以避免自加热导致读数偏差;高阻值测量需使用高输入阻抗仪表;
  • 贴装时避免过大的机械应力(弯曲或强挤压),以免产生电阻漂移或封装损伤。

七、包装与采购

  • 型号后缀 FTF 通常表示卷带盘装(Tape & Reel),适配高速贴片生产线;
  • 采购时请确认阻值与 B 值公差、工作温度范围及包装形式;如需替代或批量采购可向顺络或授权代理索取样品与规格书以验证性能。

本概述侧重器件关键电气与热学特性及工程应用要点,实际设计请结合顺络最新规格书与可靠性测试数据进行最终验证。

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