Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord HPZ1005U221-R70TF HPZ1005U221
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord HPZ1005U221-R70TF
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- HPZ1005U221-R70TF
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0257715855
- Operating Temperature
- 55℃~+125℃
- Current
- 700mA
- @Frequency
- 220Ω@100MHz
- Resistor(DCR)
- 380mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HPZ1005U221-R70TF 产品概述
一、产品简介
HPZ1005U221-R70TF 为 Sunlord（顺络）系列的一款单通道磁珠芯片型电磁干扰抑制元件，标称在 100MHz 时具有 220Ω 的抑制阻抗（±25%）。该器件适用于对射频噪声和共模/差模高频干扰有抑制需求的小型化电路，常见于移动设备、无线模块、电源输入滤波等场景。
二、电气性能
- 阻抗：220Ω @ 100MHz（公差 ±25%）。
- 直流电阻（DCR）：资料中存在不一致，来源一列示 380mΩ，另一路为 250mΩ；设计时应以厂方完整数据表为准。
- 额定电流：资料不一致（700mA 与 250mA 两种数值均有提及），请在设计前确认最终额定电流以避免过热或饱和。
- 通道数：1。
- 工作温度：-55℃ ~ +125℃。
三、结构与封装
型号名中的 1005 对应公制 0402 尺寸（1.0 × 0.5 mm）的小外形，适合高密度 PCB 布局。0402 尺寸有利于节省板面空间，但传导能力与热容较小，需注意电流与热管理。封装信息建议以顺络官方数据表或出货物料单为最终依据。
四、应用与布局建议
- 典型应用：手机与便携设备射频干扰抑制、USB/数据线输入滤波、射频前端与电源线 EMI 抑制、数字电路的局部噪声隔离。
- 布局建议：尽量靠近噪声源或需保护的芯片引脚放置，最短走线到噪声源或接地回路；若用于输入端，建议与电源去耦电容配合形成低通滤波效果。
- 焊接建议：适用于常规无铅回流焊工艺，遵循制造商推荐的回流温度曲线与预热/保温参数以保证可靠焊接。
五、可靠性与环境特性
该系列耐温范围宽（-55~125℃），满足多数工业级与消费级应用的温度要求。由于封装尺寸偏小，长期高电流或高温环境下可能出现电阻升高或特性漂移，设计时建议考虑额定电流的裕量与热散逸措施。
六、选型与注意事项
- 数据核对：当前已有参数来源存在冲突（DCR 与额定电流两组不同数据），建议在定样或量产前获取并确认顺络（Sunlord）官方完整数据表与样品。
- 余量设计：在 PCB 设计与热管理上预留裕量，避免长期以接近或超过额定电流运行。
- EMC 验证：实际电路中的阻抗与抑制效果受PCB走线、接地和周边元件影响，建议在样机阶段进行 EMI 测试与滤波优化。
如需，我可以根据你提供的最终数据表或实际测试要求，给出更具体的布局细化建议与等效电路模型。
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