WMSIC Electronic Components

Sunlord SDCL1005CR33JTDF

ModelSDCL1005CR33JTDF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL1005CR33JTDF
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL1005CR33JTDF
Electronic Component
1
Package
0402
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.019g
Inductor
330nH
Electronic Component
1
Factor
6@50MHz
Electronic Component
BM0258491026
Current
50mA
Frequency
350MHz
Resistor(DCR)
7Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDCL1005CR33JTDF 产品概述

概要

SDCL1005CR33JTDF 是由顺络(Sunlord)生产的一款高性能贴片电感,适用于各种电子设备中的高频应用。以下是对此产品的详细介绍。

基础参数

  • 电感值: 330 nH
  • 精度: ±5%
  • Q 值: 6 @ 50 MHz
  • 直流电阻 (DCR): 7 Ω
  • 自谐振频率: 350 MHz
  • 额定电流: 50 mA
  • 封装类型: 0402 (毫米尺寸为 1.0 mm x 0.5 mm)

产品特点

高频性能

SDCL1005CR33JTDF 具有优异的高频性能,Q 值在 50 MHz 时达到 6,这使得它非常适合用于射频(RF)和微波(Microwave)应用,如无线通信设备、卫星通信系统以及其他高频电子设备。

小尺寸封装

采用 0402 封装,这是一种非常小的贴片封装,适用于空间有限但要求高性能的现代电子产品。这种小尺寸设计可以帮助工程师在紧凑的 PCB 布局中实现更高的集成度和更小的体积。

高精度

电感值精度为 ±5%,这意味着实际电感值会在 330 nH 的 ±5% 范围内波动。这种高精度对于许多应用来说是必不可少的,尤其是在需要稳定和可靠的电感值的情况下。

低直流电阻

尽管 DCR 为 7 Ω,但对于许多高频应用来说,这仍然是一个可接受的值。低 DCR 有助于减少能量损失和热量生成,从而提高系统的整体效率。

高自谐振频率

自谐振频率高达 350 MHz,这意味着该电感在高频范围内不会产生不必要的谐振,从而确保系统在预期频率范围内稳定运行。

适合高频应用

由于其优异的 Q 值和高自谐振频率,SDCL1005CR33JTDF 非常适合用于各种高频应用,如滤波器、匹配网络、振荡器以及其他需要高性能电感的场景。

应用场景

无线通信设备

在手机、无线路由器、蓝牙设备等无线通信设备中,SDCL1005CR33JTDF 可以用于实现高效的信号滤波和匹配网络。

电子测量仪器

在电子测量仪器如频谱分析仪、信号发生器等中,需要高精度和高频性能的电感来确保测量结果的准确性。

医疗设备

在一些医疗设备中,如 MRI 机器或其他高频医疗设备中,需要小尺寸但高性能的电感来实现紧凑而可靠的设计。

汽车电子系统

在现代汽车电子系统中,如导航系统、无线通信模块等,SDCL1005CR33JTDF 可以提供所需的高频性能和小尺寸封装。

使用注意事项

安装和焊接

由于 0402 封装非常小,安装和焊接过程需要特别小心,以避免损坏元件或导致焊接不良。建议使用自动贴片机进行安装,并确保焊接参数符合制造商的推荐值。

电流和温度限制

确保操作电流不超过 50 mA,并且工作温度在指定范围内,以避免过热或其他故障。

EMC 和 EMI 考虑

在设计时需要考虑电磁兼容性(EMC)和电磁干扰(EMI),确保该电感不会对系统其他部分产生不利影响。

总结

SDCL1005CR33JTDF 是一款高性能贴片电感,具有优异的高频特性、小尺寸封装和高精度。它广泛应用于各种需要高频性能和紧凑设计的电子设备中。通过选择此产品,工程师可以实现更高效、更可靠的系统设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.