Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord SDFL1005QR47KTF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDFL1005QR47KTF
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDFL1005QR47KTF
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±10%
- Electronic Component
- 0.019g
- Inductor
- 470nH
- Electronic Component
- 1
- Factor
- 20@10MHz
- Electronic Component
- BM0258491041
- Current
- 15mA
- Frequency
- 80MHz
- Resistor(DCR)
- 700mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDFL1005QR47KTF 产品概述
一、主要规格与特点
SDFL1005QR47KTF 是顺络（Sunlord）推出的一款0402（1005公制）贴片电感，标称电感值为470 nH，公差±10%。额定直流电流为15 mA，直流电阻（DCR）约为700 mΩ，品质因数 Q = 20（测试频率 10 MHz），自谐振频率（SRF）约为 80 MHz。该器件体积小、适合高密度贴装的场合，主要用于信号滤波、阻抗匹配和高频隔离等应用。
二、结构与封装
0402超小封装（尺寸约1.0 × 0.5 mm）有利于节省PCB面积，但也限制了线圈截面积和导体尺寸，导致器件DCR较高和额定电流较低。器件为非极性结构，采用表面贴装工艺，适配标准回流焊流程。建议按供应商推荐焊盘设计并控制回流曲线以保证可靠焊接。
三、主要电气性能详解
- 电感值：470 nH ±10%，通常以低频测量为基准，频率上升时因寄生电容影响而逐渐下降，接近SRF时失去感性特性。
- DCR：700 mΩ，较高的直流电阻会带来一定的插入损耗，不适合用于要求低电阻损耗的电源滤波场合。
- 额定电流：15 mA，适合用于信号线和弱电路的滤波或去耦，不能作为电源侧大电流滤波元件。
- Q 与 SRF：Q=20@10MHz 表明在中频段有较好的选择性；SRF≈80 MHz，超出此频率器件将表现为并联或串联谐振，需避免在高于SRF的频段作为纯电感使用。
四、典型应用场景
- 高频信号线的串联小阻尼滤波与隔离（如射频前端的低频段滤波、测试点防干扰）。
- 模拟/数字接口的噪声抑制（I/O线、时钟线、敏感信号线）。
- 调谐或匹配电路中作为中低功率的电感元件（频率低于SRF的应用）。
- 不适合作为大电流电源滤波器或高功率阻抗元件。
五、选型与设计注意事项
- 若电路需要更低损耗或更高电流，应选用更大封装或低DCR产品；在空间受限时权衡电感值、DCR与额定电流。
- 在设计滤波网络时，考虑DCR对Q值和插入损耗的影响；在并联/串联谐振电路中预留频率裕度，避免工作频率靠近SRF。
- 对于可能存在的直流偏置，应通过样件测试确认电感随DC偏置的变化，0402尺寸的磁芯对直流偏置敏感度较小但不可忽略。
六、可靠性与焊接建议
- 遵循常规回流焊温度曲线，避免超温或过多次回流，减少应力导致的断裂风险。
- 焊接后应尽量避免机械应力，例如强烈弯折或拉伸焊盘等操作。
- 建议在批量应用前做可靠性测试（温度循环、湿热、机械冲击）以验证在目标环境下的性能稳定性。
七、采购与样片验证
- 购买时注意完整料号（SDFL1005QR47KTF）、包装形式与批次信息，向供应商索取详细数据手册与测试曲线（频率响应、温度特性、冲击与寿命试验）。
- 在量产前建议做样片评估，包含电感值频谱、插入损耗、温升与实际电流条件下的表现，确保满足系统要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
