WMSIC Electronic Components

Sunlord SDFL1005Q2R2KTF

ModelSDFL1005Q2R2KTF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDFL1005Q2R2KTF
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDFL1005Q2R2KTF
Electronic Component
1
Package
0402
Electronic Component
SMD Inductor
Electronic Component
±10%
Electronic Component
0.019g
Inductor
2.2uH
Electronic Component
1
Factor
20@10MHz
Electronic Component
BM0258491036
Current
10mA
Frequency
28MHz
Resistor(DCR)
1.7Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDFL1005Q2R2KTF 产品概述

一、产品简介

SDFL1005Q2R2KTF 为顺络(Sunlord)生产的贴片绕线电感,封装规格为 0402(公制 1005)。标称电感值为 2.2 µH,公差 ±10%,额定直流电流仅 10 mA,直流电阻(DCR)约 1.7 Ω。在 10 MHz 时品质因数 Q≈20,自谐振频率(SRF)约 28 MHz。该器件以体积小、适合微小信号滤波与高频电路特性为主要定位。

二、主要参数(概要)

  • 型号:SDFL1005Q2R2KTF
  • 品牌:Sunlord(顺络)
  • 封装:0402(1005)贴片
  • 电感值:2.2 µH ±10%
  • 额定电流:10 mA
  • 直流电阻:1.7 Ω(典型)
  • 品质因数:20 @ 10 MHz
  • 自谐振频率:28 MHz

三、特点与优势

  • 极小尺寸,便于高密度 PCB 布局与轻薄化设计。
  • 在 10 MHz 附近具有较高 Q 值,适用于对频率响应有一定要求的信号滤波。
  • SRF 约 28 MHz,工作频段内表现为良好的电感性,超过 SRF 时会出现容性行为,应避免将其作为该频段以上的感性元件使用。
  • 高 DCR 与低额定电流设计使其适合低功率、低电流的信号链路及滤波场合,而非电源大电流路径。

四、典型应用场景

  • 模拟与数字信号线的低通/共模滤波(例如传感器接口、时钟线滤波)。
  • 射频前端的滤波与谐振网络(在低于 SRF 的频段)。
  • 便携式终端与物联网终端的 EMI/ESD 前置滤波(需注意电流与功耗限制)。
  • 小信号偏置与隔离场合,如偏置电感或信号隔离元件。

五、设计与选型建议

  • 由于额定电流仅 10 mA,设计时须保证实际工作电流远低于该值,避免电感饱和或过热。
  • 高 DCR 会带来一定的压降(I×DCR),在直流偏置较大时需评估功耗与发热。
  • 使用时关注器件在目标频段的阻抗与相位特性,尽量在 SRF 以下工作以维持电感性行为。
  • 若电路对损耗敏感或需要更大电流承载,应选用 DCR 更低、额定电流更高的封装或型号。

六、封装与焊接

  • 0402 小体积对贴装与回流工艺要求较高,推荐采用自动贴片与遵循制造商回流曲线。
  • 焊盘设计应尽量短而对称,焊料量控制良好可减少应力与焊接缺陷。
  • 焊接后避免对器件施加机械力或弯曲 PCB,以免导致内部绕线损伤。

七、可靠性与环境注意事项

  • 存储与潮湿敏感度需参考顺络提供的包装与干燥条件说明,长期暴露在高湿环境可能影响焊接可靠性。
  • 作为无源元件,对静电敏感性低,但仍建议良好生产与储运管理以防机械或化学污染。
  • 在高温、高振动或大温度循环环境下,应验证封装与性能稳定性满足系统寿命要求。

八、采购与替代建议

  • 订购时请以完整型号 SDFL1005Q2R2KTF 确认规格与包装(卷带数量、湿敏等级等)。
  • 若需更高电流或更低 DCR,建议查找同系列更大封装或其他型号替代;若需更高 SRF 或更小损耗,可考虑专用射频电感或陶瓷电感替代。

如需详细频率响应曲线、温度特性、回流曲线及可靠性测试数据,请参阅顺络官方数据手册或联系供应商获取完整技术资料。

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