WMSIC Electronic Components

Sunlord PZ0603D102-R20TF PZ0603D102

ModelPZ0603D102-R20TF
Package0201
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord PZ0603D102-R20TF
Type
SUNLORD
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
PZ0603D102-R20TF
Electronic Component
1
Package
0201
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.009g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264536349
Operating Temperature
55℃~+125℃
Current
200mA
@Frequency
1kΩ@100MHz
Resistor(DCR)
1.4Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Sunlord PZ0603D102-R20TF 片式磁珠产品概述

一、产品定位与核心功能

Sunlord(顺络)PZ0603D102-R20TF是一款针对高频电磁干扰(EMI)抑制设计的微小型片式磁珠,属于该品牌0201封装系列的常规实用型号。其核心作用是在电子电路中精准滤除100MHz附近频段的杂波干扰,同时保持直流信号的低损耗传输,适配消费电子、通信设备、工业控制等领域的小型化、高密度PCB设计需求。

二、核心电气性能参数详解

该型号磁珠的关键电气指标明确,直接决定其应用场景:

  1. 阻抗特性:在100MHz频率下阻抗为1kΩ(±25%误差)——此参数是磁珠EMI抑制能力的核心体现,针对100MHz附近的高频干扰信号,能提供较高阻抗以衰减干扰,避免其耦合至敏感电路;
  2. 直流电阻(DCR):典型值1.4Ω,低DCR设计可有效降低直流工作时的功耗与发热,避免因热积累导致磁珠性能下降或电路稳定性受影响;
  3. 额定电流:200mA(直流)——即正常工作环境下允许的最大连续直流电流,若电流超过此值,磁珠可能出现阻抗漂移、发热加剧甚至损坏;
  4. 通道数:单通道设计,适用于单路电源滤波、信号线上的EMI抑制,无需额外并联/串联组合即可满足基础滤波需求。

三、物理封装与尺寸规格

PZ0603D102-R20TF采用0201封装(英制尺寸标识,对应公制约0.6mm×0.3mm),是当前小型化电子设备中主流的微小型封装之一,具体尺寸参数(参考顺络官方规格):

  • 长度:0.60±0.05mm;
  • 宽度:0.30±0.05mm;
  • 高度:0.30±0.05mm;
  • 焊盘间距:适配常规0201封装PCB焊盘设计,无需特殊布局调整,可直接嵌入高密度电路。

四、环境适应性与可靠性

  1. 工作温度范围:-55℃~+125℃,覆盖工业级、车载电子等严苛环境的温度需求,可在高低温交替场景下稳定工作,无需额外散热设计;
  2. 品牌可靠性:顺络作为国内被动器件领域的主流厂商,该型号磁珠通过RoHS、REACH等环保认证,产品一致性与可靠性经市场验证,适合批量生产应用;
  3. 耐焊接性:支持常规回流焊工艺,焊接温度范围(220℃~260℃)符合行业标准,可兼容多数PCB制造流程。

五、选型与应用注意事项

  1. 频段匹配:磁珠阻抗随频率呈“峰值特性”,该型号100MHz时阻抗最高,因此更适合抑制100MHz附近的干扰(如射频电路、高速数字电路的杂波),若需抑制其他频段干扰需更换对应型号;
  2. 电流裕量:实际电路设计中,需保证磁珠工作电流低于200mA额定值,建议预留10%~20%的裕量以应对瞬态电流波动(如开关电源的启动电流);
  3. 布局建议:磁珠应尽可能靠近干扰源(如开关电源、射频发射端)或敏感电路的输入端,减少干扰信号在PCB上的辐射路径;
  4. 焊接工艺:0201封装对焊接精度要求较高,避免手工焊接时的过热(超过280℃易损坏磁珠)或虚焊问题,推荐采用自动贴装+回流焊工艺。

六、典型应用场景

该型号磁珠可广泛应用于以下场景:

  • 消费电子:智能手机、平板电脑的射频电路滤波(如WiFi、蓝牙模块);
  • 通信设备:路由器、交换机的电源与信号线上的EMI抑制;
  • 工业控制:小型PLC、传感器模块的抗干扰设计;
  • 车载电子:低功耗车载设备(如行车记录仪、胎压监测)的辅助电路滤波(若需车规认证,需确认具体型号版本)。

综上,Sunlord PZ0603D102-R20TF凭借小型化封装、精准的100MHz频段干扰抑制能力及宽温适应性,成为中低端电子设备EMI滤波的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.