Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品名称: SDCL1005C2N7BTDF
商品分类: 贴片电感
品牌: Sunlord (顺络)
封装: 0402
电感值: 2.7nH
直流电阻 (DCR): 200mΩ
额定电流: 300mA
SDCL1005C2N7BTDF 是 Sunlord (顺络) 公司推出的一款高性能贴片电感,采用 0402 封装,具有超小尺寸和高频特性,广泛应用于各类电子设备中。该电感具有 2.7nH 的电感值和 200mΩ 的低直流电阻,能够在高频电路中提供稳定的性能表现。其额定电流为 300mA,适用于低功耗和高频应用场景。
超小尺寸
SDCL1005C2N7BTDF 采用 0402 封装,尺寸仅为 1.0mm x 0.5mm,非常适合空间受限的紧凑型设计,如智能手机、平板电脑、可穿戴设备等。
高频特性
电感值为 2.7nH,适用于高频电路设计,如射频(RF)模块、无线通信设备、蓝牙模块等,能够有效抑制高频噪声和干扰。
低直流电阻
直流电阻 (DCR) 仅为 200mΩ,能够减少能量损耗,提高电路效率,特别适合低功耗应用。
高额定电流
额定电流为 300mA,能够满足大多数低功耗设备的需求,同时确保电感的稳定性和可靠性。
高品质材料
采用优质材料和先进工艺制造,具有良好的温度稳定性和耐久性,能够在 -40°C 至 +125°C 的宽温度范围内正常工作。
SDCL1005C2N7BTDF 广泛应用于以下领域:
| 参数名称 | 参数值 |
|---|---|
| 商品分类 | 贴片电感 |
| 品牌 | Sunlord (顺络) |
| 封装 | 0402 |
| 电感值 | 2.7nH |
| 直流电阻 (DCR) | 200mΩ |
| 额定电流 | 300mA |
| 工作温度范围 | -40°C 至 +125°C |
| 尺寸 | 1.0mm x 0.5mm |
高性价比
SDCL1005C2N7BTDF 在保证高性能的同时,具有较高的性价比,能够帮助客户降低生产成本。
可靠性高
采用先进的生产工艺和严格的质量控制,确保产品在各种应用场景下的高可靠性和长寿命。
易于集成
0402 封装设计使得该电感易于集成到各种 PCB 设计中,简化了生产流程,提高了生产效率。
电路设计
在设计高频电路时,建议将 SDCL1005C2N7BTDF 用于滤波、阻抗匹配和噪声抑制等关键位置,以充分发挥其高频特性。
焊接工艺
由于采用 0402 封装,建议使用回流焊工艺进行焊接,以确保焊接质量和可靠性。
温度管理
在高温环境下使用时,建议合理设计散热方案,以确保电感在额定温度范围内正常工作。
SDCL1005C2N7BTDF 是一款高性能、高可靠性的贴片电感,适用于高频、低功耗的电子设备。其超小尺寸、低直流电阻和高额定电流使其成为各类紧凑型设计的理想选择。无论是消费电子、通信设备还是工业电子,SDCL1005C2N7BTDF 都能提供卓越的性能和稳定性,满足客户多样化的需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products