Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord GZ1005D601TF
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord GZ1005D601TF
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- GZ1005D601TF
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0257364365
- Operating Temperature
- 55℃~+125℃
- Current
- 100mA
- @Frequency
- 600Ω@100MHz
- Resistor(DCR)
- 900mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GZ1005D601TF 产品概述 — Sunlord（顺络）0402 磁珠
一、产品简介
GZ1005D601TF 是顺络（Sunlord）0402 封装的单通道磁珠，标称阻抗 600 Ω @ 100 MHz，误差 ±25%，直流电阻（DCR）约 900 mΩ，额定直流电流 100 mA，工作温度范围 -55 ℃ ~ +125 ℃。适用于需要在高频段抑制干扰的电源或信号链路的小尺寸滤波场合。
二、关键电气参数与意义
- 阻抗：600 Ω @ 100 MHz（±25%）——在 100 MHz 附近对高频噪声有显著衰减效果，常用于射频干扰 (EMI) 抑制。
- 直流电阻：900 mΩ——直流下产生的压降为 V = I·R = 0.1 A × 0.9 Ω = 0.09 V（90 mV），功耗 P = I^2·R = 0.1^2 × 0.9 = 9 mW；在额定电流下热损耗很小。
- 额定电流：100 mA——超过该值可能出现阻抗下降或过热，要按实际电流裕量选择。
三、封装与可靠性
0402（约 1.0 mm × 0.5 mm）超小封装，适合空间受限的移动设备、IoT、可穿戴和消费类电子产品。工作温度 -55~+125 ℃，符合一般工业级环境要求。为确保可靠性，推荐按厂家给出的回流焊曲线和焊盘设计进行贴装，避免过度机械应力。
四、典型应用场景与布局建议
- 应用：电源线、数据线和射频前端的 EMI 抑制；SMD 滤波前置元件；与去耦电容配合构成 π 型滤波。
- 布局建议：靠近噪声源或进入敏感模块处放置，短引线、靠近接地点；在高速差分信号线上慎用（可能影响信号完整性），在电源轨上常与电容并联或串联使用以形成低通效果。
五、选型与测试要点
注意阻抗随频率变化和在直流偏流下的非线性特性；±25% 的阻抗公差在高精度滤波场合需考虑裕量。建议获取厂商的阻抗频率曲线（Z–f）、温度特性和 S 参数，实测时用阻抗分析仪在目标频段验证实际表现。用于关键或严苛环境时，检查是否满足相应的可靠性与认证要求（如 AEC-Q 等）。
总结：GZ1005D601TF 在体积极小的条件下，提供在 100 MHz 附近较高的噪声抑制能力，适合对空间和成本敏感的 EMI 解决方案，但在电流、压降与信号完整性方面需做工程评估。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
