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Sunlord SDCL1005C2N4BTDFM01
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDCL1005C2N4BTDFM01
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL1005C2N4BTDFM01
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.019g
- Inductor
- 2.4nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0264825678
- Current
- 850mA
- Frequency
- 6GHz
- Resistor(DCR)
- 200mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1005C2N4BTDFM01 产品概述
一、产品简介
SDCL1005C2N4BTDFM01 是顺络（Sunlord）推出的一款 0402 封装叠层贴片电感，标称电感值 2.4 nH。器件体积小、寄生参数受控，适合高频和空间受限的电路设计。封装尺寸对应国际 0402（1005 公制），适用于自动贴装生产线。
二、主要电气参数
- 电感值：2.4 nH
- 额定直流电流：850 mA（容许持续通过电流）
- 直流电阻（DCR）：约 200 mΩ
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：约 6 GHz
- 类型：叠层无磁芯贴片电感
这些参数表明该器件在几十 MHz 到低 GHz 频段仍能保持较好特性，SRF 高达 6 GHz，适用于射频前端和高频匹配网络。
三、产品优势与适用场景
- 体积极小，适合移动设备、RF 模块、蓝牙/Wi‑Fi、GPS 等空间受限场合。
- 低电感值、较高 SRF 适合用于阻抗匹配、谐振电路、介入式滤波与谐振器设计。
- 良好的制作一致性与自动化贴装兼容性，适合大批量生产。
典型应用：射频输入输出阻抗匹配、射频滤波器、电源去耦（高速路径抑制）、天线匹配网络以及 EMI 抑制网络。
四、封装与布局建议
- 0402（1005）小封装要求 PCB 布局紧凑，建议遵循厂方推荐焊盘尺寸以确保可靠焊接。
- 为保证高频性能，应尽量缩短与相邻元件之间的走线，减少不必要的过孔与串联寄生。
- 对于射频匹配，建议在板上进行实际测量并微调电感值与周边电容，以补偿 PCB 寄生电容。
五、使用注意事项
- 温升与电流能力：接近或超过额定电流时，电感值可能因温升或磁饱和（对叠层结构较小）而下降，建议在设计时留有余量。
- 回流焊与可靠性：按照 IPC/JEDEC 推荐的回流温度曲线进行焊接，避免过高峰值温度与重复加热。
- 高频特性：Q 值为 8 @100MHz，随频率变化会降低；在 GHz 频段应使用网络分析仪验证实际性能。
- 封装小尺寸对手工焊接不利，推荐采用表面贴装工艺。
六、设计与测试建议
- 在射频应用中，优先在目标 PCB 工况下用 S‑参数测试器件的实际表现；如需更高 Q 值或更低 DCR，可考虑更大封装或不同材料系列。
- 在滤波或匹配网络中，与电容形成的谐振频率需考虑 PCB 寄生电容的贡献，调试时应以测量为准。
总结：SDCL1005C2N4BTDFM01 是一款面向高频及受限空间应用的 2.4 nH 0402 叠层电感，兼顾体积与频率性能，适用于移动终端与射频模块的阻抗匹配与滤波场景。设计时注意热管理、布局和焊接工艺，可在实际电路中取得稳定可靠的高频表现。
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