WMSIC Electronic Components

Sunlord SDCL0603Q5N1ST02

ModelSDCL0603Q5N1ST02
Package0201
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL0603Q5N1ST02
Type
SUNLORD
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL0603Q5N1ST02
Electronic Component
1
Package
0201
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.009g
Inductor
5.1nH
Electronic Component
1
Factor
13@500MHz
Electronic Component
BM0265148811
Current
350mA
Frequency
5.9GHz
Resistor(DCR)
400mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDCL0603Q5N1ST02 产品概述

一、产品简介

SDCL0603Q5N1ST02 是顺络(Sunlord)推出的一款叠层贴片电感,标称电感值为 5.1 nH。该器件为小体积表面贴装元件,适合高密度 PCB 设计中的高频电路与 EMI 控制场景。主要电气参数:额定电流 210 mA,直流电阻(DCR)约 460 mΩ,属于低感量、低功率、高频率应用方向的元件。

二、主要特性

  • 电感值:5.1 nH,适合射频匹配、滤波与负载隔离等高频用途。
  • 额定电流:210 mA,适用于微功率或信号链路场合,非大电流电源滤波。
  • 直流电阻:约 460 mΩ,DCR 较高会带来一定直流压降和功耗,设计时需注意热量与稳态电流。
  • 结构:叠层陶瓷/磁性材料(Multilayer),体积小、稳定性好、适合自动化贴装。
  • 封装:产品型号为 SDCL0603...,属于 0603 类小尺寸封装(如需 0201 尺寸请另行确认型号与参数)。

三、应用场景

  • 射频前端:用于微带线匹配、寄生电容补偿与谐振点微调。
  • EMI/EMC 抑制:在信号线上实现高频噪声隔离与衰减。
  • 高速数字链路:作为阻抗控制或共模/差模处理的部分元件(需结合实际频谱评估)。
  • 低功率模拟电路:滤波、阻抗隔离与旁路匹配等。

四、选型与注意事项

  • 电流与功耗:210 mA 的额定电流决定了该器件不适合大电流应用;DCR 0.46 Ω 在直流场合会产生明显压降,应评估功耗与发热。
  • 频率响应:5.1 nH 在不同电路拓扑下对应不同自谐频率(SRF),在高频应用中需参考厂方频率特性曲线进行仿真与验证。
  • 封装与可靠性:0603 小体积有利于高密度布局,但对焊接工艺敏感,建议按厂家回流曲线进行回流焊工艺控制。
  • 仿真验证:在关键射频或高速信号路径中,建议在 PCB 上做实际 S 参数测试或在电路仿真中加入 DCR 与寄生参数进行验证。

五、焊接与储存建议

  • 焊接:推荐采用符合 IPC 标准的回流焊工艺,遵循顺络提供的温度曲线,避免过高峰值温度与过长加热时间。
  • 存储:避免潮湿与污染,未开封状态下按厂家建议的干燥箱或环境条件保存;开封后在规定时间内使用完毕以防吸湿影响焊接性与可靠性。

六、采购信息

  • 品牌:Sunlord(顺络)
  • 型号:SDCL0603Q5N1ST02
  • 订购时建议确认封装尺寸与电气参数(如需 0201 尺寸或不同电感值,请与供应商核对替代型号)。

如需完整器件数据手册(含频率特性曲线、温度漂移、典型 S 参数、回流曲线与可靠性测试数据),建议索取顺络官方资料以便在设计中准确使用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.