Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord SDCL1005C1N3STDF
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDCL1005C1N3STDF
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL1005C1N3STDF
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.019g
- Inductor
- 1.3nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0257715503
- Current
- 400mA
- Frequency
- 10GHz
- Resistor(DCR)
- 100mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1005C1N3STDF 产品概述
一、产品简介
SDCL1005C1N3STDF 为顺络（Sunlord）系列叠层贴片电感，封装尺寸为 0402（1005英制）。该器件电感量为 1.3 nH，额定电流 400 mA，直流电阻（DCR）约 100 mΩ，品质因数 Q=8（@100 MHz），自谐振频率（SRF）为 10 GHz。此类超小型高频电感针对空间受限且对高频性能有要求的消费电子与无线通信应用而设计。
二、主要技术参数
- 电感值：1.3 nH
- 额定电流：400 mA（参考值，实际工作电流请考虑温升与磁饱和）
- 直流电阻（DCR）：100 mΩ
- 品质因数：Q = 8（测试频率 100 MHz）
- 自谐振频率：10 GHz
- 封装：0402（1005）表面贴装，叠层结构
三、典型应用场景
此款 1.3 nH 小电感常用于：
- 射频阻抗匹配网络、回路调谐元件
- 高频滤波、L 型匹配、电源或射频偏置网络的阻抗元件
- 无线模块、手机射频前端、蓝牙/Wi‑Fi 子电路、微带线匹配
- 对尺寸与寄生要求严格的高频微波设计
四、设计与布局建议
- 封装极小，建议严格按照厂商提供的推荐焊盘尺寸设计 PCB，以保证焊接可靠性与一致的电气性能。
- 该电感 DCR 较高，在直流电流流经时会有热量产生，设计时需考虑功率耗散与温升，尽量避免长时间在额定电流附近工作。
- 高频应用中尽可能缩短与相邻元件的连线，避免形成不必要的寄生电感或耦合。对地层或大面积铜皮的接近可能影响电感特性，应在布局时留意仿真验证。
五、焊接与可靠性
- 适用于常规 SMT 回流工艺。建议遵循制造商回流温度曲线与 IPC 标准，以避免焊接应力导致性能退化。
- 在高温回流或多次回流情况下，建议在生产流程初期做样板试验以验证电感值与 DCR 的稳定性。
- 常见可靠性试验包括高低温循环、湿热、振动与机械冲击，选型时可参考顺络的具体数据手册与认证报告。
六、选型及替代考量
- 若电流要求更高或 DCR 需更小，考虑增大封装（如 0603/0805）或选择专为功率优化的型号。
- 若工作频率靠近或超过 SRF，应选择 SRF 更高或更适合微波频段的器件。
- 下游设计时如需更高 Q 值以减小损耗，可与顺络或其它厂商的相近规格型号做对比测试，选取最佳折衷方案。
总结：SDCL1005C1N3STDF 以其 0402 的超小尺寸与 10 GHz 的高自谐频率，适合对体积和高频性能有严格要求的射频与微波应用。在实际使用中请参考厂方推荐封装尺寸与回流工艺，并考虑 DCR 与额定电流带来的热管理与电气折减。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
