WMSIC Electronic Components

Sunlord SDCL1005C1N5STDF

ModelSDCL1005C1N5STDF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL1005C1N5STDF
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL1005C1N5STDF
Electronic Component
1
Package
0402
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.019g
Inductor
1.5nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0257364585
Current
300mA
Frequency
6GHz
Resistor(DCR)
100mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDCL1005C1N5STDF 产品概述

一、产品简介

SDCL1005C1N5STDF 是顺络(Sunlord)出品的一款贴片叠层电感,0402(1005公制)超小封装,标称电感值 1.5 nH。该器件为表面贴装多层陶瓷结构,适合高密度 PCB 和射频前端的小体积电感需求,兼顾体积、寄生参数和可贴装性。

二、主要电气参数

  • 电感值:1.5 nH
  • 额定电流:300 mA(最大工作电流)
  • 直流电阻(DCR):100 mΩ
  • 品质因数(Q):8 @ 100 MHz
  • 自谐振频率(SRF):6 GHz
  • 封装:0402(1005)表面贴装
    DCR 在 300 mA 时带来的铜耗约为 I^2·R ≈ 0.3^2×0.1Ω ≈ 9 mW,实际温升受 PCB 散热和周边环境影响。

三、性能特点与典型应用

  • 体积非常小,适合空间受限的便携设备与高密度模块。
  • Q 值在 100 MHz 约为 8,适合需要一定选择性但不追求极高 Q 的射频匹配与滤波电路。
  • SRF 高达 6 GHz,表明在 GHz 频段仍可保持可预测的行为,但接近 SRF 时电感值会显著下降,应在设计仿真中考虑寄生电容影响。
    典型应用包括:射频输入/输出匹配网络、微带线补偿、射频偏置隔离(小电流偏置电感)、带内 EMI 抑制、天线馈线网络及小尺寸滤波元件。

四、封装与装配建议

  • 0402/1005 尺寸适合贴片机高速贴装,常见卷带(Tape & Reel)包装,兼容无铅回流焊工艺。
  • 布局时尽量缩短连接引线/过孔,避免把电感端点紧邻大面积铜箔或强耦合走线,减小寄生电容和走线寄生感。
  • 贴片焊盘应按厂家推荐尺寸设计,使用焊膏印刷控制焊量;回流曲线遵循无铅工艺规范,避免过度热冲击。
  • 装配和波峰/再流后避免过大弯曲或机械应力,存储建议干燥包装、防潮处理。

五、选型与替代建议

  • 若需更低 DCR 或更高电流容量,可考虑更大封装(0603、0805)或同系列大电流型号。
  • 若目标为更高 Q 或更窄带滤波,建议选择专用高 Q 线绕电感或片式射频电感系列。
  • 设计时如需在靠近 SRF 的工作点使用,应配合电磁仿真或实测频率响应以验证实际性能。

六、总结

SDCL1005C1N5STDF 在体积、频率覆盖与贴片兼容性间取得平衡,适用于移动通信、无线模块和高密度射频前端的微小电感需求。选型时应考虑额定电流与 DCR 对损耗和温升的影响,并在接近自谐振频率的设计中进行充分验证和仿真。

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