WMSIC Electronic Components

Sunlord SZ1608K272TF

ModelSZ1608K272TF
Package0603
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SZ1608K272TF
Type
SUNLORD
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SZ1608K272TF
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.027g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264825709
Operating Temperature
55℃~+125℃
Current
200mA
@Frequency
2.7kΩ@100MHz
Resistor(DCR)
1.4Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Sunlord SZ1608K272TF 片式磁珠产品概述

顺络电子(Sunlord)推出的SZ1608K272TF是一款专为高频电磁干扰(EMI)抑制设计的表面贴装磁珠,凭借高阻抗特性、宽温适应性及小型化封装,成为消费电子、通信设备、工业控制等领域电路抗干扰的核心元件。以下从产品定位、参数解析、环境特性等维度展开概述。

一、产品定位与应用场景

SZ1608K272TF属于顺络高频高阻抗磁珠系列,核心定位是针对100MHz频段附近的杂散信号进行高效衰减,同时兼顾小电流电路的直流损耗控制。其典型应用场景包括:

  • 消费电子:智能手机、平板的WiFi/蓝牙射频电路、电源线路滤波,抑制100MHz左右的信号串扰,提升无线传输稳定性;
  • 通信设备:基站、路由器的信号接口、电源模块滤波,降低高频干扰对数据传输的误码率;
  • 工业控制:PLC、传感器、伺服系统的信号线路,适配-55℃~+125℃宽温环境,满足工业现场恶劣工况;
  • 车载电子:车载信息娱乐系统、ADAS传感器的抗干扰设计(部分低温场景),提升车载电路电磁兼容性(EMC)。

二、核心电气参数解析

SZ1608K272TF的电气参数经过精准优化,关键指标如下:

  1. 高频阻抗特性:100MHz频率下阻抗达2.7kΩ,误差±25%。磁珠阻抗由铁氧体材料磁导率决定,高频下感抗占比高,此参数确保对100MHz左右干扰的强衰减能力;
  2. 直流电阻(DCR):仅1.4Ω,低直流损耗意味着磁珠对电路正常直流信号的压降影响极小,适合保留直流偏置的滤波场景(如射频电路偏置线);
  3. 额定电流:200mA是磁珠允许的最大连续工作电流,超过此值会导致温升过高、阻抗下降甚至损坏,需严格匹配电路工作电流;
  4. 通道数:1通道设计,适用于单条信号/电源线路的独立滤波,避免多通道串扰。

三、物理与环境特性

  1. 小型化封装:采用SZ1608封装(对应英制0603,公制尺寸1.6mm×0.8mm×0.8mm),体积小巧,节省PCB布局空间,适配高密度集成设备;
  2. 宽温工作范围:-55℃~+125℃的温度区间,覆盖工业级、部分车载级环境要求,极端温度下仍保持稳定阻抗特性;
  3. 材料特性:顺络自研高性能铁氧体材料,高频磁导率稳定,阻抗曲线一致性好,批次差异小,适合量产应用。

四、封装与可靠性说明

  1. 表面贴装封装:SMD 0603封装,支持自动化贴装,生产效率高,焊接兼容性好;
  2. 可靠性验证:通过高温存储(125℃×1000h)、温度循环(-55℃~+125℃×1000次)、湿度测试(85℃/85%RH×1000h)等试验,符合IEC 61000-4-2等EMC标准,长期工作稳定;
  3. 环保合规:符合RoHS 2.0、REACH法规,不含铅、镉等有害物质,满足全球市场准入要求。

五、选型与使用注意事项

  1. 参数匹配:干扰集中在100MHz附近时优先选用;若干扰频率偏离(如<50MHz或>200MHz),需参考顺络对应阻抗曲线的产品;
  2. 布局优化:磁珠靠近干扰源(如射频芯片输出端)或敏感电路(如MCU输入端口),减少耦合路径;避免与高频信号线平行布线;
  3. 焊接要求:焊接温度230℃~260℃,单个磁珠焊接时间≤10秒,避免高温损坏材料;
  4. 降额使用:环境温度>85℃时,额定电流降额至160mA(80%额定值),延长寿命。

总结

SZ1608K272TF凭借高频高阻抗、低直流损耗、宽温适应性及小型化封装,成为多领域EMI抑制的优选元件,顺络的品质保障使其在量产应用中具备稳定可靠的性能表现。

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