WMSIC Electronic Components

Sunlord SWPA4018S100MT

ModelSWPA4018S100MT
PackageSMD,4x4mm
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SWPA4018S100MT
Type
SUNLORD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SWPA4018S100MT
Electronic Component
1
Package
SMD,4x4mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.008g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0257364586
Current
840mA
Resistor(DCR)
234mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
1.6A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SWPA4018S100MT 产品概述

一、产品简介

SWPA4018S100MT 是顺络(Sunlord)推出的一款表面贴装功率电感,额定电感值为 10 μH,公差 ±20%。器件采用 4×4 mm 的紧凑 SMD 封装,专为空间受限的电源滤波与储能应用设计,兼顾较高的电流承载能力与低直流电阻,适用于中低功率 DC-DC 变换器与电源管理模块。

二、主要电气参数

  • 电感值:10 μH(±20%)
  • 额定电流:840 mA(连续工作时的温升与特性保证电流)
  • 饱和电流 Isat:1.6 A(电感值下降至额定值的特定比例时的临界电流)
  • 直流电阻 DCR:234 mΩ(较低的 DCR 有利于减小 I²R 损耗)
    这些参数表明器件在中等电流等级下具有良好的能量储存与滤波能力,同时在突发电流条件下能保持较稳定的电感特性直到饱和点。

三、产品特点

  • 紧凑封装:4×4 mm SMD,有利于高密度 PCB 布局与 SMT 生产。
  • 适配中等电流:额定电流 840 mA,Isat 达 1.6 A,适合常见便携设备与嵌入式电源。
  • 低损耗:234 mΩ 的 DCR 在同类封装中处于合理范围,可降低系统功耗与发热。
  • 良好的可靠性与一致性:顺络作为专业被动件厂商,提供工业级质量控制与出厂测试。

四、典型应用场景

  • 降压/升压型 DC-DC 转换器输出滤波与能量储存
  • 手机、平板与便携式设备的电源管理模块
  • 小型通信设备、物联网终端与工业控制板的 EMI 抑制与电源滤波
  • 各类功率/信号混合板的局部电源隔离

五、设计与选型建议

  • 饱和裕度:若电路可能出现短脉冲或突发大电流,应确保峰值电流低于 Isat,推荐在设计中留出适当裕量(例如 20–50%),以避免电感饱和导致效率下降与电压波动。
  • 温升与散热:连续接近额定电流工作时注意器件温升,必要时采用分散布线或铜平面改善散热。
  • 漫流与纹波:在开关电源中,注意电感的所承受纹波电流(ΔI),计算平均电流与纹波分量对发热和磁饱和的影响。
  • 布局:电感应靠近开关器件与电源输入/输出端布置,走短且粗的电流回流路径以降低寄生电感与噪声。
  • 焊接工艺:遵循顺络提供的回流焊温度曲线与 PCB 推荐封装过孔/焊盘尺寸以保证焊接可靠性。

六、可靠性与选购提示

选购时确认批次规格与测试条件(例如测量频率、环境温度),并参考厂商的样片测试报告和推荐的应用电路。对关键应用建议做实际工况下的热测试与寿命评估,确保在目标运行环境中满足长期稳定性和可靠性要求。

如需进一步资料(尺寸图、纹波容限曲线、回流曲线或样片申请),建议联系顺络官方技术支持或当地授权分销商获取器件的详细数据手册与参考设计。

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