Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord SDCL1005C5N6STDFM01
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDCL1005C5N6STDFM01
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL1005C5N6STDFM01
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.019g
- Inductor
- 5.6nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0264992347
- Current
- 650mA
- Frequency
- 4GHz
- Resistor(DCR)
- 300mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1005C5N6STDFM01 产品概述
一、产品简介
SDCL1005C5N6STDFM01 为顺络（Sunlord）出品的0402（公制1005）封装叠层贴片电感，标称电感值 5.6 nH，直流电阻（DCR）约 300 mΩ，额定电流 650 mA。该器件以小体积实现良好的高频性能，固有自谐振频率约 4 GHz，品质因数 Q≈8（@100 MHz），适合在 GHz 级应用中用作射频匹配、滤波与去耦等场合。
二、主要电气参数
- 电感值：5.6 nH
- 额定电流：650 mA（持续导通）
- 直流电阻（DCR）：300 mΩ（典型）
- 品质因数：8 @ 100 MHz（典型）
- 自谐振频率（SRF）：约 4 GHz
- 类型：叠层（多层）贴片电感
- 封装：0402（1005公制）
三、性能亮点
- 小尺寸（0402）适合高密度 SMT 布局，对空间受限的射频与高速电路友好。
- 高自谐频率（≈4 GHz）使器件在数 GHz 频段仍保持有效电感特性，适用于射频匹配网络与谐振回路。
- Q 值在 100 MHz 范围具有良好表现，有利于降低损耗、提高选择性。
- 额定电流 650 mA 在小封装中提供较好的电流承载能力，适合射频偏置或小电流滤波应用。
四、典型应用场景
- 射频匹配网络（天线匹配、功率放大器输入/输出调谐）
- 高频滤波与谐振电路（VCO、滤波器）
- EMI 抑制与共模/差模小信号滤波（需配合其他元件）
- 高速接口去耦与阻抗整形（在频域要求 GHz 级别性能时）
五、设计与布局建议
- 采用推荐的 0402 焊盘尺寸并保证焊盘对称，避免过长走线以降低寄生电感与寄生电容对高频特性影响。
- 对于射频通道，尽量短且直线的走线以维护器件标称频率响应；必要时通过仿真（电磁或电路仿真）验证匹配网络性能。
- 在高温或高电流工况下注意器件的温升与额定电流裕量，建议保留一定余量以提高可靠性。
- 焊接工艺兼容常规回流焊流程，建议按照制造商推荐的回流温度曲线进行焊接，避免过热导致性能退化。
六、选型与注意事项
- 由于 DCR 在 0402 小封装中相对较高（约 300 mΩ），在直流电流较大或对功耗敏感的应用中需评估损耗。
- 自谐振频率表明器件在高于 SRF 的频段电感特性丧失，选型时应确保工作频率低于 SRF 并考虑寄生效应。
- 如需更高 Q 值或更大的电流承载能力，可考虑更大封装或不同材料的叠层电感器件。
- 最终可靠性与性能参数请参考顺络官方数据手册及样品测量数据，量产前建议进行实际电路测试与环境应力验证。
若需该型号的原厂数据手册、封装尺寸图或批量采购信息，可提供具体需求，我可协助查询并整理关键资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
