WMSIC Electronic Components

Sunlord GZ1005D600CTF

ModelGZ1005D600CTF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
Sunlord GZ1005D600CTF
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
GZ1005D600CTF
Electronic Component
1
Package
0402
Electronic Component
0.019g
Electronic Component
1
Electronic Component
BM0265857324
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

顺络GZ1005D600CTF 贴片磁珠产品概述

一、产品基本定位与封装规格

顺络GZ1005D600CTF是一款0402封装贴片铁氧体磁珠,专为高频电磁干扰(EMI)抑制设计,属于顺络常规商用/工业级磁珠系列。0402封装对应公制尺寸1.0mm×0.5mm,适配高密度PCB布局需求,尤其适合便携式、小型化电子设备的电路紧凑化设计。

二、核心电气性能参数

该磁珠的关键性能聚焦于100MHz频段的阻抗特性,核心参数如下:

  • 阻抗特性:在100MHz测试频率下,阻抗标称值为60Ω(60R),公差±25%;需注意磁珠阻抗随频率变化,此参数为其典型工作频段的核心滤波指标;
  • 电流承载能力:额定直流电流(Idc)为500mA,可满足多数中小功率电路的电源/信号线路滤波需求;
  • 工作温度范围:-55℃~+125℃,覆盖工业级与汽车级部分应用场景的温度要求;
  • 通道数:单通道设计,适用于单路信号/电源的EMI抑制,无多通道串扰风险。

三、典型应用场景与核心优势

3.1 典型应用场景

  • 便携式消费电子:手机、智能手环、TWS蓝牙耳机等设备的射频电路、电源模块滤波,抑制100MHz附近的电磁干扰(如蓝牙、WiFi频段的杂波);
  • 汽车电子:车载传感器(胎压监测、摄像头)、小型控制模块的EMI防护,适配-55℃~+125℃的宽温环境;
  • 工业物联网终端:小型PLC、无线传感器节点的信号线路滤波,避免高频干扰影响数据传输稳定性。

3.2 核心优势

  • 小型化适配:0402封装大幅节省PCB空间,贴合当前电子设备轻薄化趋势;
  • 宽温稳定:-55℃~+125℃的工作范围,极端环境下性能无明显衰减;
  • 频段针对性:60Ω@100MHz的阻抗特性,精准匹配100MHz频段的EMI抑制需求;
  • 电流匹配性:500mA额定电流覆盖多数便携设备单路电源/信号电流范围,无需额外降额设计。

四、可靠性与环境适应性

顺络作为国内磁珠领域主流品牌,该产品可靠性具备以下特点:

  • 材料稳定性:采用高性能铁氧体材料,额定电流与温度范围内无明显磁饱和,阻抗特性稳定;
  • 焊接可靠性:符合RoHS环保要求,焊接工艺兼容常规回流焊参数(峰值温度≤245℃、时间≤10s),焊点强度满足行业标准;
  • 环境耐受性:通过温湿度循环(-40℃+85℃,95%RH)、振动冲击(102000Hz,1.5g)等测试,适配严苛应用场景。

五、选型与应用注意事项

  1. 阻抗特性认知:磁珠阻抗为频率相关参数,并非直流电阻,不可替代普通电阻使用;
  2. 电流降额建议:高温环境(如+125℃)下,建议按额定电流的80%使用,避免发热影响性能;
  3. 焊接工艺要求:0402封装需控制回流焊温度,避免过热损坏铁氧体材料;
  4. 应用方式:需串联在信号/电源线路中(如电源正极、射频信号线),并联无法实现EMI抑制效果。

该产品凭借小型化、宽温稳定与频段针对性,成为100MHz附近EMI抑制场景的高性价比选择,适配多数便携、工业与汽车电子的常规需求。

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