Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord SDCL1005C1N0BTDFM01
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- Sunlord SDCL1005C1N0BTDFM01
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL1005C1N0BTDFM01
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Electronic Component
- BM0265857319
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1005C1N0BTDFM01 产品概述
1. 产品简介
SDCL1005C1N0BTDFM01 是一款由 Sunlord（顺络）公司生产的贴片电感，电感值为 1nH，采用 0402 封装。该产品广泛应用于各种电子设备中，特别是在高频电路中，用于滤波、阻抗匹配和信号处理等应用。
2. 产品特点
- 电感值: 1nH，适用于高频电路。
- 封装: 0402，体积小巧，适合高密度 PCB 布局。
- 品牌: Sunlord（顺络），知名电子元器件制造商，产品质量可靠。
- 应用: 适用于射频（RF）电路、微波通信、无线通信设备等。
3. 技术参数
- 电感值: 1nH
- 封装尺寸: 0402（1.0mm x 0.5mm）
- 工作温度范围: -40°C 至 +125°C
- 直流电阻（DCR）: 低直流电阻，减少能量损耗。
- 额定电流: 高额定电流，适用于大电流应用。
- Q值: 高品质因数，确保高频性能。
4. 应用领域
SDCL1005C1N0BTDFM01 广泛应用于以下领域：
- 射频（RF）电路: 用于手机、无线通信设备等。
- 微波通信: 用于卫星通信、雷达系统等。
- 无线通信设备: 用于蓝牙、Wi-Fi 模块等。
- 高频滤波: 用于信号滤波和噪声抑制。
5. 产品优势
- 高可靠性: Sunlord 公司严格的质量控制体系，确保产品的高可靠性。
- 高性能: 低直流电阻和高 Q 值，确保产品在高频应用中的优异性能。
- 小型化: 0402 封装，适合高密度 PCB 布局，节省空间。
- 广泛适用性: 适用于多种高频电路和通信设备。
6. 使用注意事项
- 焊接: 使用适当的焊接工艺，避免过热损坏电感。
- 存储: 存放在干燥、无尘的环境中，避免潮湿和污染。
- 操作: 在规定的温度范围内使用，避免超出额定电流。
7. 结论
SDCL1005C1N0BTDFM01 是一款高性能、高可靠性的贴片电感，适用于各种高频电路和通信设备。其小巧的封装和优异的性能使其成为电子设计中的理想选择。Sunlord 公司的品牌保证和严格的质量控制体系，确保该产品在各种应用中的稳定性和可靠性。
通过以上概述，可以看出 SDCL1005C1N0BTDFM01 在电子元器件中的重要地位和广泛应用。无论是射频电路、微波通信还是无线通信设备，该产品都能提供卓越的性能和可靠性，满足各种设计需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
