WMSIC Electronic Components

Sunlord SWPA5040S4R7MT

ModelSWPA5040S4R7MT
PackageSMD,5x5mm
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
Sunlord SWPA5040S4R7MT
Type
SUNLORD
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SWPA5040S4R7MT
Electronic Component
1
Package
SMD,5x5mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.008g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0227092357
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SWPA5040S4R7MT — Sunlord(顺络)功率电感产品概述

一、产品简介

SWPA5040S4R7MT 是顺络(Sunlord)面向开关电源与功率管理设计的表贴功率电感。标称电感值为 4.7 μH,公差 ±20%,采用 SMD 封装,外形尺寸为 5.0 × 5.0 mm。该器件定位为高电流、低损耗的功率电感,适用于中小功率 DC–DC 变换器和电源滤波场合。

二、主要特性(通用描述)

  • 电感值:4.7 μH(±20%)
  • 封装形式:SMD,方形 5×5 mm 尺寸,利于面板密集布置
  • 品牌:Sunlord(顺络)
  • 面向用途:开关电源(降压/升压)、输出滤波、电源去耦与储能
  • 典型优势:低直流电阻(DCR)与较高电流承载能力,降低铜损与温升(具体参数请参照厂方数据表)

三、应用场景

  • 高效 DC–DC 降压(Buck)/ 升压(Boost)转换器
  • 多相电源模块与点对点供电
  • LED 驱动器、电机驱动小功率段
  • 通信与基站设备的电源滤波与缓冲
  • 消费类电子(笔电、电源适配器、便携设备)电源管理

四、选型建议

  • 考虑工作电流与饱和电流(Isat):功率电感在直流偏置下会显著降低电感量,应根据实际峰值电流与纹波电流选择合适额定/饱和电流余量。
  • 注意公差 ±20% 对谐振频率与纹波电流的影响:若电路对电感值敏感,应评估最差情形下的工作点或考虑公差更小的型号。
  • 关注 DCR 与总功耗:选择低 DCR 型号可降低热损,提升转换效率;高密度布板时需兼顾散热设计。
  • 温度与稳定性:确认工作环境温度范围与电感温度特性,以避免在高温下性能下降或磁芯退磁。

五、布局与焊接要点

  • 尽量缩短电感与开关器件(MOSFET/电容)之间的导线路径,以减小寄生电感与辐射。
  • 为高电流路径采用较宽的铺铜并必要时加过孔(thermal/via)以改善电流承载与散热。
  • 遵循元件制造商的回流焊温度曲线进行焊接,避免超出最大回流温度导致磁芯或封装损伤。
  • 生产与维修时避免强力挤压元件顶部,防止机械应力影响绕组或磁芯结构。

六、资料与验证

在最终设计前,建议获取并核对顺络官方数据手册,关注关键参数(饱和电流、额定电流、DCR、温升曲线、频率特性、耐压与环境规范)。对样品在目标电路中进行热、效率与电磁兼容(EMC)测试,验证在实际工况下的表现。

若需进一步提供数据表、封装图或参考布板(PCB footprint)建议,我可以协助检索或整理关键参数以便选型与验证。

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