Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
概述: SDCL1608CR33JTDF 是一款高性能的贴片电感,由知名品牌 Sunlord(顺络)制造。该电感的参数精确,适用于要求较高的电子应用,尤其是在高频电路和紧凑型设备中具有广泛的应用潜力。其小巧的0603封装形式,使其在空间受限的应用中显得尤为高效。
关键参数:
电感值与性能: SDCL1608CR33JTDF 的电感值为330nH,这一数值使其适合用于高频电路和信号滤波等应用。较小的电感值能够快速响应信号的变化,常用于高频开关电源、射频电路以及无线通信设备中。
直流电阻与额定电流: 该电感的直流电阻(DCR)为2.8Ω,表明其在直流电流下的电压损耗相对较低,这有助于提高整体电路的效率。此外,150mA的额定电流使得该产品在大多数常见应用中都能稳定工作,提供可靠的性能。
自谐振频率(SRF): 自谐振频率为350MHz,表示该电感在该频率下的表现显著改善,适用于高频应用。这意味着SDCL1608CR33JTDF在设计中能够有效地抑制高频噪声,同时保持良好的频率响应,适合于RF和微波设计。
品质因数(Q值): Q值是无源电子元件的重要参数之一,SDCL1608CR33JTDF在50MHz时显示出Q值为8,表明其具有相对较高的电感性能及低损耗。这一特性非常适合于需要高品质因数以降低信号衰减和电源噪音的应用,如高频滤波器、共振回路等。
封装规格: SDCL1608CR33JTDF 采用0603 封装,这种小型化设计使其非常适合现代电子设备的需求,尤其是在空间有限的印刷电路板(PCB)设计中。0603 封装尺寸为1.6mm x 0.8mm,能够有效地减少整体设备的体积,同时提供良好的焊接性和机械稳定性。
应用场景: SDCL1608CR33JTDF 在多个领域均有应用潜力,尤其是在:
总结: SDCL1608CR33JTDF 贴片电感以其优越的电性能和小巧的0603封装,成为设计现代电子设备的重要元件。高Q值、低DCR和合适的电感值,均使其在高频和电源管理应用有着极佳的表现。选择SDCL1608CR33JTDF,可以有效提升产品的性能和竞争力。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products