WMSIC Electronic Components

Sunlord SZ1005K121CTF

ModelSZ1005K121CTF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SZ1005K121CTF
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SZ1005K121CTF
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.019g
Electronic Component
1
Channel Count
1
Electronic Component
BM0265698034
Operating Temperature
55℃~+125℃
@Frequency
120Ω@100MHz
Resistor(DCR)
400mΩ
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Sunlord SZ1005K121CTF 片式磁珠产品概述

一、产品基本属性与封装规格

SZ1005K121CTF是顺络电子推出的超小型片式磁珠,采用行业标准0402封装(对应公制尺寸1005,具体参数:长1.0±0.2mm、宽0.5±0.2mm、厚度0.5±0.1mm),属于单通道磁珠(通道数1),可直接贴装于高密度PCB板,适配当前电子设备小型化、轻薄化的设计需求。

二、核心电气性能参数

该磁珠的核心性能围绕高频EMI抑制与宽温可靠性设计,关键参数如下:

  • 阻抗特性:120Ω±25%@100MHz(磁珠核心功能参数,针对100MHz附近的电磁干扰有显著抑制效果);
  • 直流电阻(DCR):400mΩ(同封装磁珠中属于低损耗水平,可减少电路直流功耗,避免发热影响性能);
  • 工作温度范围:-55℃~+125℃(覆盖工业级、汽车级严苛环境温度,极端温度下性能无明显漂移);
  • 额定电流:符合顺络0402磁珠常规规格(约500mA),满足一般电子电路负载需求。

三、设计特点与材料优势

  1. 高性能材料:采用顺络自主研发的镍锌铁氧体材料,相比锰锌材料更适配高频应用,100MHz附近阻抗特性稳定,长期使用无性能衰减;
  2. 小封装适配:0402封装体积小,可集成于紧凑电路布局,支持手机、汽车电子等小型化设备;
  3. 宽温可靠性:通过严格温度循环测试(-55℃低温无开裂、+125℃高温阻抗无漂移),符合工业级/汽车级可靠性要求;
  4. 低损耗设计:400mΩ的低DCR可降低直流压降,提升电路效率,尤其适合对功耗敏感的消费电子、通信设备。

四、典型应用场景

该磁珠因高频阻抗特性与宽温优势,广泛应用于以下领域:

  • 消费电子:智能手机Wi-Fi/蓝牙模块EMI滤波、音频电路噪声抑制,提升通信与音质稳定性;
  • 工业控制:PLC数字接口、传感器模拟线路的电磁干扰过滤,保证工业环境下数据传输准确;
  • 汽车电子:车载导航、车身传感器(温度/压力传感器)的EMC防护,满足车规级温宽要求;
  • 通信设备:路由器、交换机高频信号链路的杂散信号抑制,优化信号质量。

五、应用注意事项

  1. 频率匹配:磁珠阻抗为100MHz测试值,若目标干扰频率偏离该范围,需参考顺络提供的频率-阻抗曲线选择合适型号;
  2. 电流压降:结合电路最大工作电流计算压降(如500mA电流下,压降约0.2V),避免影响供电稳定性;
  3. 焊接规范:遵循0402封装SMT工艺,回流焊峰值温度≤245℃、焊接时间≤30秒,避免高温损坏材料;
  4. 存储要求:开封前置于常温干燥环境(25℃±5℃、湿度60%±10%),开封后尽快使用,未使用磁珠需密封保存防受潮。

SZ1005K121CTF凭借高性价比、宽温可靠性与小封装优势,成为电子设备EMI抑制的常用元件,可满足多领域的电磁兼容(EMC)设计需求。

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