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Sunlord SDCL1005C30NJTDF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- Sunlord SDCL1005C30NJTDF
- Type
- SUNLORD
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL1005C30NJTDF
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.019g
- Inductor
- 30nH
- Electronic Component
- 1
- Electronic Component
- BM0258491038
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1005C30NJTDF 产品概述
一、产品简介
SDCL1005C30NJTDF 为顺络（Sunlord）系列贴片叠层电感，额定电感值 30 nH，公差 ±5%，封装规格为 0402（公制 1005，约 1.0 mm × 0.5 mm）。该器件采用叠层陶瓷/磁性材料结构，适用于高频场合的阻抗匹配与共振回路，兼顾体积微小与电性能稳定性。
二、主要性能特点
- 电感值：30 nH，公差 ±5%，满足对精度要求较高的射频与滤波应用；
- 类型：叠层贴片电感，体积小、重量轻，利于高密度贴装；
- 0402 封装：占板面积极小，适合移动终端与微型模块化设计；
- 高频特性良好：设计用于高频环境，具有较低直流电阻与较高 Q 值（具体参数请参见厂家数据手册）；
- 工艺兼容：适配常规无铅回流焊流程，适合 SMT 批量生产。
三、典型应用场景
- 射频前端：匹配网络、阻抗调节；
- EMI/EMC 抑制：高频噪声滤波与抑制；
- 无线通信终端：蓝牙、Wi‑Fi、移动通信模块等射频回路；
- 高频电路中的去耦与谐振回路，及空间受限的消费电子与物联网设备。
四、封装与安装注意事项
- 封装为 0402（1005），焊盘与焊膏设计应确保良好焊接可靠性；
- 推荐遵循厂商回流焊温度曲线与 IPC/JEDEC 标准，避免过热或多次超温循环；
- 贴装时避免对器件施加过大机械应力（如板弯曲、尖端压迫），以免引起结构性损伤或电感漂移；
- 清洗与焊后处理应选用对磁性/陶瓷材料安全的工艺，避免强酸强碱或超声清洗时间过长。
五、可靠性与环境适应
顺络产品通常通过多项可靠性测试（热循环、湿热、振动等），适应常见工业与消费环境。具体的温度范围、最大允许电流与寿命指标请以厂家提供的完整数据表为准。为保证长期稳定性，建议在设计期进行实际电路验测与老化评估。
六、选型与替代建议
在替代或并用时，应优先匹配电感值、封装尺寸、工作频段及公差。若对 Q 值、饱和特性或温度系数有严格要求，请向顺络索取详细电性能曲线或样品验证，以确保在目标应用下达到预期性能。
（说明：以上为基于器件基本信息的产品概述，更多精确电气参数与机械尺寸请参考顺络官方数据手册或联系供应商获取技术支持。）
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