Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
该产品为顺络电子(Sunlord)推出的非屏蔽绕线电感,采用0402(英制封装,对应公制1005尺寸)超小型贴片设计,核心电感值为68nH,主要面向高频小功率电子电路的滤波、谐振、信号耦合等场景,兼顾体积紧凑性与电气性能稳定性,适配高密度集成的消费电子、通信设备。
额定电感值为68nH,精度±5%,满足多数通用电路对电感值一致性的要求,无需额外添加补偿电路,可简化PCB设计流程,降低开发成本。
最大允许直流电流为170mA,当工作电流不超过该阈值时,电感磁芯无饱和现象,电感值变化量控制在±10%以内(常规测试条件下),保证电路信号传输稳定。
典型值为1.35Ω,反映电感绕线的直流损耗。在小信号电路中,此损耗对信号强度影响极小;同时,低DCR有助于控制器件发热,适合长期连续工作场景。
采用0402封装(尺寸:0.04英寸×0.02英寸,约1.0mm×0.5mm),属于行业主流超小型贴片规格,可大幅节省PCB布局空间,适配智能手机、智能穿戴等高密度集成设备。
无金属屏蔽外壳的绕线结构,虽EMI(电磁干扰)抑制能力弱于屏蔽电感,但体积更小、成本更低,适合对EMI要求不高的射频前端、小信号处理电路。
采用高精度自动绕线技术,电感值一致性好(批量生产偏差≤±2%),抗机械应力能力较强,可承受SMT贴片过程中的260℃高温回流焊,生产良率达99.5%以上。
顺络电子作为国内电感行业龙头企业,该产品符合RoHS 2.0、REACH等环保指令要求,生产过程通过ISO9001/TS16949质量管理体系认证;产品经过以下可靠性测试:
可满足消费电子、通信设备的长期使用需求,一致性与稳定性处于行业领先水平。
该产品以高性价比、小体积优势,成为高频小信号电路的主流选型之一,适配多类终端设备的集成化设计需求。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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