WMSIC Electronic Components

Sunlord SDCL1608C18NJTDF

ModelSDCL1608C18NJTDF
Package0603
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDCL1608C18NJTDF
Type
SUNLORD
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDCL1608C18NJTDF
Electronic Component
1
Package
0603
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.027g
Inductor
18nH
Electronic Component
1
Factor
12@100MHz
Electronic Component
BM0257364584
Current
300mA
Frequency
2.2GHz
Resistor(DCR)
550mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDCL1608C18NJTDF 产品概述

一、产品简介

SDCL1608C18NJTDF 为顺络(Sunlord)出品的0603(1608公制)贴片电感,标称电感量为 18 nH,公差 ±5%,直流电阻(DCR)约 550 mΩ,额定电流 300 mA,品质因数 Q = 12(@100 MHz),自谐振频率(SRF)2.2 GHz。该器件尺寸小、频率响应良好,适用于高密度贴片电路中的射频/传输线匹配与滤波应用。

二、主要电气参数

  • 电感值:18 nH ±5%
  • 额定电流:300 mA(最大持续工作电流,建议留有裕量)
  • 直流电阻(DCR):550 mΩ(典型值)
  • 品质因数:Q = 12(@100 MHz)
  • 自谐振频率:SRF = 2.2 GHz
  • 封装:0603(1608)贴片封装
  • 品牌:Sunlord(顺络)

三、性能特点

  • 小尺寸:0603 封装适合高密度 PCB 布局与自动贴装工艺。
  • 高频性能稳定:Q 值在100 MHz 时较高,自谐振点 2.2 GHz,适合至 GHz 级别的射频链路。
  • 容量与损耗平衡:18 nH 属于中低量级,用于阻抗匹配或谐振回路时可兼顾带宽与抑制能力。
  • 可焊性好:符合常见回流焊工艺要求,适合 SMT 生产线。

四、典型应用场景

  • 射频前端的阻抗匹配、阻抗补偿与谐振网络(如 2G/3G/4G 子系统需评估 SRF 限制)。
  • 高频滤波器、谐振回路、带通/带阻网络的元件。
  • 信号线、天线匹配与调整电路(注意直流电阻对信号幅度的影响)。
  • 小电流电源滤波、去耦(在电流与损耗允许范围内)。

五、使用与设计注意事项

  • 直流电阻较高(0.55 Ω),在 300 mA 满载时电压降约 0.165 V、功耗约 50 mW,应评估功率耗散与温升对周边电路的影响。
  • 电感值会受到直流偏置影响,实际工作中随电流增加可能出现降低,设计需留裕量。
  • 频率使用上限由 SRF 决定,建议在低于 SRF 的频段使用以保证感性响应。接近 SRF 时会出现容性行为。
  • PCB 布局建议将电感尽量靠近信号源或负载端放置,短引线以降低寄生,必要时加旁路或屏蔽以减少耦合干扰。
  • 焊接工艺按顺络推荐的回流曲线执行,避免过高温度或过长热循环以防封装/材料应力。

六、可靠性与合规

顺络产品通常通过了常规的可靠性试验(温度循环、湿热、机械振动与冲击等),并符合 RoHS 要求。实际项目中建议根据系统的工作环境参考厂方数据表进行热循环与寿命评估。

如需进一步的 S 参数、频率响应曲线、封装图纸或针对特定应用的等效电路与仿真数据,可提供具体工作频段与电流条件,我可协助给出更详细的选型与布局建议。

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