WMSIC Electronic Components

Sunlord GZ1608D121CTF

ModelGZ1608D121CTF
Package0603
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord GZ1608D121CTF
Type
SUNLORD
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
GZ1608D121CTF
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.027g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264536483
Operating Temperature
55℃~+125℃
Current
500mA
@Frequency
120Ω@100MHz
Resistor(DCR)
200mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Sunlord GZ1608D121CTF 片式磁珠产品概述

顺络电子(Sunlord)推出的GZ1608D121CTF是一款针对高频电磁干扰(EMI)抑制设计的片式陶瓷磁珠,凭借紧凑封装、精准阻抗特性及宽温可靠性,广泛适用于消费电子、汽车电子、工业控制等领域的噪声滤波场景。

一、产品基本信息与封装说明

  • 品牌与型号:Sunlord(顺络电子),型号GZ1608D121CTF;
  • 封装规格:型号标识“1608”对应公制1608封装(即英制0603封装),实际尺寸约1.6mm×0.8mm×0.5mm(长×宽×高),属于小型化表面贴装元件,适配自动化贴装工艺,可有效节省PCB布局空间;
  • 环保合规:符合RoHS 2.0及REACH标准,无铅无卤,满足全球市场环保要求。

二、核心电气参数及特性

磁珠的核心性能围绕“频率依赖型阻抗”展开,关键参数如下:

  1. 阻抗特性:100MHz频率下阻抗为120Ω,误差±25%——该阻抗峰值针对100MHz左右的高频噪声(如射频干扰、开关电源噪声)设计,能精准抑制目标频段的电磁干扰;
  2. 直流电阻(DCR):最大直流电阻200mΩ——低DCR设计减少直流损耗,避免磁珠对信号/电源的直流传输效率造成明显影响;
  3. 额定电流:最大允许直流工作电流500mA——满足多数中低功率电源支路(如5V/3.3V电源滤波)、信号线路的电流承载需求,过载会导致阻抗下降、温度升高;
  4. 工作温度范围:-55℃~+125℃——覆盖工业级及汽车级基础应用环境,极端温度下保持性能稳定;
  5. 通道数:单通道设计,适用于单路线路的噪声滤波。

三、典型应用领域

GZ1608D121CTF的性能匹配多场景EMI抑制需求,常见应用包括:

  1. 消费电子:手机、平板、智能穿戴的电源滤波(电池到主板供电)、射频信号线路(WiFi/蓝牙天线周边),小封装适配紧凑内部空间;
  2. 汽车电子:车载中控屏电源、导航模块信号、车身控制单元(BCM)传感器线路,宽温范围满足舱内温度波动;
  3. 工业控制:PLC、工业传感器(温度/压力)的信号线路,抑制工业现场电磁干扰;
  4. 通信设备:路由器、交换机电源模块滤波、以太网接口线路,针对100MHz噪声抑制效果显著。

四、产品设计亮点

  1. 小封装高密度:0603(1608)封装体积小,可在高密度PCB上实现多通道滤波布局,提升电路集成度;
  2. 精准噪声抑制:120Ω@100MHz阻抗针对主流高频噪声频段优化,无需额外匹配即可有效过滤干扰;
  3. 低损耗高效能:200mΩ低DCR减少直流电压降,避免影响负载供电稳定性,适合便携设备;
  4. 宽温可靠性:-55℃~+125℃温宽覆盖多数极端场景,长期工作符合工业及汽车级标准;
  5. 高电流承载:500mA额定电流满足多数中低功率线路需求,无需并联磁珠简化设计。

五、使用注意事项

  1. 频率匹配:磁珠阻抗随频率变化(100MHz左右达峰值),若噪声频率偏离,需参考顺络阻抗-频率曲线确认效果;
  2. 电流降额:实际应用建议电流不超额定值80%(400mA),避免长期过载衰减性能;
  3. 温宽确认:环境温度超125℃需选顺络更高温宽产品(如150℃系列);
  4. 贴装工艺:0603封装需注意贴装精度,焊接温度符合顺络回流焊曲线(峰值245℃左右),防止损坏。

这款磁珠凭借平衡的性能参数与可靠设计,成为多领域EMI抑制的高性价比选择,尤其适合对空间、温宽及电流承载有明确要求的场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.