WMSIC Electronic Components

Sunlord MWSD1005C18NGT

ModelMWSD1005C18NGT
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord MWSD1005C18NGT
Type
SUNLORD
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
MWSD1005C18NGT
Electronic Component
1
Package
0402
Type
Display Inductor
Electronic Component
Power Inductor
Electronic Component
±2%
Electronic Component
0.014g
Inductor
18nH
Electronic Component
1
Electronic Component
BM0264889142
Current
370mA
Resistor(DCR)
280mΩ
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MWSD1005C18NGT 顺络0402非屏蔽功率电感产品概述

一、产品定位与核心属性

MWSD1005C18NGT是顺络电子(Sunlord)针对小型化低功耗电子设备设计的绕线式非屏蔽功率电感,型号中“1005”对应公制封装(长1.0mm×宽0.5mm),英制标注为0402。其核心定位是在有限PCB空间内实现小电流电源电路的储能/滤波功能,兼顾成本优势与性能稳定性,适配消费电子、物联网终端等高密度布局场景。

二、关键电气参数详解

该电感的参数直接决定应用边界,需重点关注以下维度:

  1. 电感值与精度:标称18nH,精度±2%——满足高频电源电路(如DC-DC降压、LDO滤波)对电感值稳定性的要求,避免因偏差导致输出电压波动;
  2. 额定电流:370mA(顺络定义为温升电流,即25℃环境下电感表面温升≤40℃时的最大连续电流)——适配智能手表、蓝牙模块等低功耗设备的典型工作电流(100-300mA),若电流超此值需降额使用;
  3. 直流电阻(DCR):280mΩ(典型值)——低DCR可降低自身损耗(300mA下损耗仅约25mW),显著提升电池续航能力;
  4. 非屏蔽结构:无金属屏蔽罩,结构更紧凑、成本更低,但EMI抑制能力弱于屏蔽型,需结合场景EMI要求选型。

三、封装与结构特点

  1. 封装规格:典型尺寸为长1.0mm±0.2mm、宽0.5mm±0.2mm、高0.5mm±0.2mm,适配智能手机主板等高密度PCB的0402封装区;
  2. 结构设计:采用铁氧体磁芯+铜漆包线绕制,绕线紧密且磁芯贴合度高,保证电感值在-40℃~+125℃宽温范围内稳定;支持回流焊工艺(260℃/10s焊接,符合IPC标准),适配自动化贴片生产;
  3. 环境适应性:工作温度覆盖工业级与消费电子场景,可满足户外IoT终端、车载辅助设备的低温/高温需求。

四、典型应用场景

该电感因体积小、低损耗、电流适配性强,广泛应用于:

  1. 便携式消费电子:智能手机、智能手表、TWS耳机的电源管理模块(DC-DC降压储能电感、LDO输出滤波电感);
  2. 物联网终端:传感器节点、蓝牙/WiFi模块、低功耗MCU的供电滤波电路(适配100-350mA工作电流);
  3. 小型通信设备:蓝牙5.0/5.1模块、2.4G无线耳机的电源匹配网络(辅助稳定射频供电);
  4. 工业低功耗设备:小型温湿度传感器、无线抄表终端的供电电路(宽温范围适配户外环境)。

五、选型与使用注意事项

  1. 电流匹配:应用最大连续电流需≤370mA,峰值电流超此值时建议降额30%以上,避免电感饱和导致电感值骤降;
  2. EMI考量:非屏蔽结构易产生电磁辐射,若应用于医疗设备、高精度传感器等EMI敏感场景,需搭配屏蔽罩或滤波电容;
  3. PCB布局:焊盘需按顺络推荐尺寸设计(长1.2mm×宽0.6mm),避免虚焊或短路;
  4. 温度限制:长期工作温度需控制在-40℃~+125℃内,高温场景下需评估电感寿命衰减。

总结

MWSD1005C18NGT以体积紧凑、低损耗、宽温适配为核心优势,精准匹配小型化低功耗设备的电源管理需求,是消费电子、IoT终端等领域的高性价比电感方案。选型时需结合电流、EMI要求,确保性能稳定。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.