Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord WPN252012H1R5MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord WPN252012H1R5MT
- Type
- SUNLORD
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- WPN252012H1R5MT
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.008g
- Inductor
- 1.5uH
- Electronic Component
- 1
- Electronic Component
- BM0257715509
- Current
- 2.4A
- Resistor(DCR)
- 72mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
- and Current(Isat)
- 3.5A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WPN252012H1R5MT 产品概述
产品名称：WPN252012H1R5MT
商品分类：功率电感
品牌：Sunlord（顺络）
封装：SMD（表面贴装）
1. 产品介绍
WPN252012H1R5MT是一款高性能的表面贴装功率电感，具备1.5μH的电感值，适用于多种高频及功率应用场景。该电感模块结合了先进的电感技术，以其优异的功率处理能力和低直流电阻（DCR）特性，被广泛应用于电源管理、DC-DC转换器、RF模块和其他相关电子设备。
2. 技术参数
电感值：1.5μH
此电感值使得WPN252012H1R5MT在处理快速的电流变化时表现出色，适合于高频应用。直流电阻 (DCR)：72mΩ
低电阻值意味着在正常工作条件下产生的热量较少，从而提高整机的能量效率。额定电流：2.4A
WPN252012H1R5MT能够承受2.4A的持续工作电流，适合于需要稳定电流供给的电源系统。饱和电流 (Isat)：3.5A
一旦电感的电流达到3.5A，电感值可能开始显著降低，仍然确保最终应用具有一系列的安全裕度。精度：±20%
这种精度水平适用于很多应用场景，确保了电感的稳定性和可靠性。
3. 主要特性
高功率密度：由于其小巧的SMD封装设计，WPN252012H1R5MT在有限的PCB空间内提供了较高的功率处理能力，适用于小型化电子设备。
卓越的热管理：低DCR意味着更低的功耗和发热，适合长时间高负载工作，同时可以延长产品的使用寿命。
广泛的适用性：该产品特别设计用于DC-DC转换器、负载电源，尤其在计算电子、高频信号处理和电池供电管理应用中表现优异。
环保设计：顺络在制造过程中遵循环保原则，符合RoHS标准，确保产品在使用过程中的可持续性。
4. 应用场景
WPN252012H1R5MT因其强大的电性能特点，通常应用于多种领域，包括但不局限于：
- 电源管理：作为稳压电源及DC-DC转换器中的关键元器件，用于提升电源效率。
- 通信设备：在基站、信号处理模块和不同的通信终端中，确保信号的稳定与可靠。
- 消费电子：用于手机、平板电脑等消费类电子产品中，提供稳定的电源支持。
- 汽车电子：在电动车和传统汽车的电源管理系统中，应用于高效电能转换。
5. 总结
WPN252012H1R5MT是一款高质量的功率电感，凭借其卓越的电性能与稳定性，已成为众多电子产品不可或缺的组成部分。其广泛的应用范围、优秀的工作参数及环保特性，使其在市场上赢得了良好的口碑。选择WPN252012H1R5MT，不仅是对产品质量的信赖，更是对高效能和可持续发展的承诺。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
