WMSIC Electronic Components

Sunlord SZ1005G121TF

ModelSZ1005G121TF
Package0402
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SZ1005G121TF
Type
0402
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SZ1005G121TF
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.019g
Electronic Component
1
Channel Count
1
Electronic Component
BM0265590024
Operating Temperature
55℃~+125℃
Current
400mA
@Frequency
120Ω@100MHz
Resistor(DCR)
400mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

顺络SZ1005G121TF片式磁珠产品概述

一、产品核心参数清单

顺络SZ1005G121TF是一款针对100MHz频段优化的小型化片式磁珠,核心参数如下:

  • 阻抗特性:100MHz频率下阻抗为120Ω,阻抗误差±25%;
  • 直流电阻(DCR):最大400mΩ,低电阻设计减少自身功耗;
  • 额定电流:直流额定电流400mA,满足小功率电路滤波需求;
  • 封装尺寸:0402公制封装(对应英制0402,尺寸1.0mm×0.5mm);
  • 工作温度范围:-55℃至+125℃,覆盖工业级宽温环境;
  • 通道数:单通道设计,适用于单路信号/电源滤波。

二、关键特性深度解析

1. 高频干扰精准抑制

该磁珠针对100MHz频段做了阻抗优化,120Ω的阻抗值可精准衰减该频段的电磁干扰(EMI),同时对直流/低频目标信号的传输损耗极小——磁珠“低频低阻抗、高频高阻抗”的特性,使其能在不影响核心信号的前提下,过滤高频噪声(如射频电路的杂波、电源纹波的高频分量)。

2. 低功耗与散热优势

400mΩ的直流电阻在同类0402封装磁珠中处于较低水平,当工作电流达到额定值400mA时,自身功耗仅为0.064W(计算:(I^2 \times R = 0.4A^2 \times 0.4Ω)),不会因过度发热导致电路效率下降或温度超标,适合长期连续工作场景(如工业传感器、智能穿戴设备)。

3. 小体积高密度集成

0402封装(1.0mm×0.5mm)是电子设备“轻薄化”趋势下的主流小型化封装,能显著减少PCB占用面积,适配智能手机、智能手表等高密度集成终端,同时兼容常规SMT贴装工艺,降低生产难度。

4. 宽温环境可靠性

-55℃至+125℃的工作温度范围,覆盖了工业控制、车载辅助电路等严苛环境需求:例如工业PLC的户外控制柜(冬季低温、夏季高温)、车载显示屏的高温工作环境,均能稳定发挥滤波作用,无需额外降额使用。

三、典型应用场景

1. 消费电子射频滤波

  • 智能手机/平板电脑:用于WiFi、蓝牙等射频电路的电源滤波,抑制100MHz附近的杂波干扰,保障无线信号传输稳定性;
  • 智能穿戴设备:如智能手表的心率传感器、加速度传感器电路滤波,小体积匹配设备紧凑设计,同时宽温特性适应佩戴时的温度变化(如户外暴晒、室内低温)。

2. 工业控制设备

  • PLC与传感器模块:过滤工业现场的电磁干扰(如电机、变频器产生的100MHz附近噪声),避免干扰控制信号导致误动作;
  • 工业物联网终端:如远程温度监测传感器的电源滤波,低功耗设计延长电池续航(若采用电池供电)。

3. 通信设备EMI抑制

  • 路由器/交换机:高频电路的噪声过滤,减少设备之间的电磁干扰,提升数据传输速率与稳定性;
  • 基站辅助模块:小功率辅助电路(如电源管理模块)的滤波,适配基站的宽温工作环境(-40℃~+85℃)。

四、封装与可靠性说明

1. 封装与焊接兼容性

  • 尺寸规范:1.0mm(长)×0.5mm(宽)×0.5mm(高),符合IPC-J-STD-001标准的焊盘设计要求;
  • 焊接工艺:支持常规SMT回流焊(260℃峰值温度下可承受3次回流),无铅焊接兼容性符合RoHS 2.0标准,满足环保要求。

2. 可靠性测试验证

顺络该系列磁珠通过多项行业标准测试:

  • 温度循环测试:-55℃~125℃循环500次,阻抗变化率≤±3%;
  • 湿热测试:85℃/85%RH环境下放置1000小时,DCR变化率≤±5%;
  • 机械振动测试:符合IEC 60068-2-6标准(振动频率10~2000Hz,加速度2g),性能无衰减。

五、选型与使用注意事项

1. 阻抗匹配验证

需确认应用场景的干扰频率是否集中在100MHz附近——若干扰频率偏移至200MHz(如WiFi 6E频段)或50MHz(如部分工业电机噪声),需选择对应频段磁珠(如200Ω@200MHz、60Ω@50MHz),避免滤波效果不佳。

2. 电流裕量设计

建议实际工作电流不超过额定电流的80%(即320mA),预留裕量防止磁珠因电流过大饱和(饱和后阻抗急剧下降,失去滤波作用)。

3. 功耗与散热考量

若电路中多个磁珠并联/串联,需计算总功耗(如2个磁珠并联,总功耗为单颗的2倍),确保PCB焊盘及周边区域散热良好,避免局部过热影响其他元器件。

4. 焊盘设计规范

0402封装的焊盘尺寸建议为0.6mm×0.3mm(长×宽),焊盘间距0.2mm,避免焊盘过大导致连锡,或过小导致虚焊(影响焊接可靠性)。

本概述覆盖了产品的核心参数、特性、应用场景及工程选型要点,可作为电子设计中EMI滤波方案的参考依据。

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