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顺络SZ1005G121TF是一款针对100MHz频段优化的小型化片式磁珠,核心参数如下:
该磁珠针对100MHz频段做了阻抗优化,120Ω的阻抗值可精准衰减该频段的电磁干扰(EMI),同时对直流/低频目标信号的传输损耗极小——磁珠“低频低阻抗、高频高阻抗”的特性,使其能在不影响核心信号的前提下,过滤高频噪声(如射频电路的杂波、电源纹波的高频分量)。
400mΩ的直流电阻在同类0402封装磁珠中处于较低水平,当工作电流达到额定值400mA时,自身功耗仅为0.064W(计算:(I^2 \times R = 0.4A^2 \times 0.4Ω)),不会因过度发热导致电路效率下降或温度超标,适合长期连续工作场景(如工业传感器、智能穿戴设备)。
0402封装(1.0mm×0.5mm)是电子设备“轻薄化”趋势下的主流小型化封装,能显著减少PCB占用面积,适配智能手机、智能手表等高密度集成终端,同时兼容常规SMT贴装工艺,降低生产难度。
-55℃至+125℃的工作温度范围,覆盖了工业控制、车载辅助电路等严苛环境需求:例如工业PLC的户外控制柜(冬季低温、夏季高温)、车载显示屏的高温工作环境,均能稳定发挥滤波作用,无需额外降额使用。
顺络该系列磁珠通过多项行业标准测试:
需确认应用场景的干扰频率是否集中在100MHz附近——若干扰频率偏移至200MHz(如WiFi 6E频段)或50MHz(如部分工业电机噪声),需选择对应频段磁珠(如200Ω@200MHz、60Ω@50MHz),避免滤波效果不佳。
建议实际工作电流不超过额定电流的80%(即320mA),预留裕量防止磁珠因电流过大饱和(饱和后阻抗急剧下降,失去滤波作用)。
若电路中多个磁珠并联/串联,需计算总功耗(如2个磁珠并联,总功耗为单颗的2倍),确保PCB焊盘及周边区域散热良好,避免局部过热影响其他元器件。
0402封装的焊盘尺寸建议为0.6mm×0.3mm(长×宽),焊盘间距0.2mm,避免焊盘过大导致连锡,或过小导致虚焊(影响焊接可靠性)。
本概述覆盖了产品的核心参数、特性、应用场景及工程选型要点,可作为电子设计中EMI滤波方案的参考依据。
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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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