Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord SDCL1608CR27JTDF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord SDCL1608CR27JTDF
- Type
- SUNLORD
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- SDCL1608CR27JTDF
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.027g
- Inductor
- 270nH
- Electronic Component
- 1
- Factor
- 8@50MHz
- Electronic Component
- BM0264825693
- Current
- 150mA
- Frequency
- 350MHz
- Resistor(DCR)
- 2.6Ω
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SDCL1608CR27JTDF 产品概述 — 顺络 0603 贴片电感 270nH ±5% 150mA
一、产品简介
SDCL1608CR27JTDF 为顺络（Sunlord）推出的 0603（1608公制）贴片电感，标称电感值 270nH，公差 ±5%，额定直流电流 150mA。该型号在小封装下兼顾较高的电感值与方便贴片工艺，适用于对体积要求严格且需一定阻抗特性的电路中。
二、主要电气参数
- 电感值：270 nH ±5%
- 额定电流：150 mA
- 直流电阻（DCR）：2.6 Ω
- 品质因数（Q）：8 @ 50 MHz
- 自谐振频率（SRF）：350 MHz
这些参数表明器件在几十到数百兆赫兹范围内工作特性可被预期，但较高的 DCR 带来明显的直流损耗和热耗散，需要在设计时考虑。
三、性能特点与适用频段
- Q=8（50MHz）显示在 50MHz 附近有中等的选择性，SRF=350MHz 以上开始失去电感性特征。
- 由于 DCR 较大（2.6Ω），该电感更适合作为阻抗元件、去耦或 EMI 抑制用，而非追求极低损耗的射频谐振线圈。
- 适用频段通常为几十MHz以下至百MHz量级，对于高频低损耗射频通带滤波需谨慎选型。
四、封装与焊接
SDCL1608CR27JTDF 为 0603 尺寸贴片器件，兼容常见贴片生产线与回流焊工艺。建议遵循顺络的回流温度曲线和焊膏工艺规范，避免过度机械应力。贴片方向和焊盘设计应保证良好焊接面积并便于回流合格率。
五、设计与热管理建议
- 直流损耗计算：在额定电流 150mA 下，功耗约 P = I^2·R = 0.15^2×2.6 ≈ 58.5 mW，长期工作时需考虑温升和周围器件受热。
- 建议在实际工作电流下进行热仿真与测量，必要时留有电流余量（建议工作电流低于额定值的 80% 以内，视应用与散热条件而定）。
- PCB 布局上保持进出线最短、避免大面积铜皮直接覆盖器件上方，以减少寄生影响和降低磁耦合对周边敏感电路的干扰。
六、测试与质量把控
出厂前建议对电感值、DCR、Q 值和 SRF 进行抽样测试，使用 LCR 表与阻抗分析仪验证频域特性。顺络产品通常满足无铅制程和 RoHS 要求，具体认证可参考厂方数据手册与质保文件。
七、典型应用场景
- EMI 抑制与共模/差模滤波（小信号路径）
- 电源去耦与噪声抑制（低电流场合）
- 高频模拟与数字接口的抗干扰设计（需考虑 DCR 影响）
总结：SDCL1608CR27JTDF 在 0603 尺寸中提供了 270nH 的电感选项，适合体积受限且对中等频率阻抗有要求的应用。选用时应重点关注其较高 DCR 带来的功耗与热效应，并在 PCB 布局与实际测量中进行校核。若需更低损耗或更高电流能力，可咨询顺络替代型号或更大封装选项。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
