WMSIC Electronic Components

Sunlord SDFL1608P1R2KTF

ModelSDFL1608P1R2KTF
Package0603
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord SDFL1608P1R2KTF
Type
SUNLORD
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
SDFL1608P1R2KTF
Electronic Component
1
Package
0603
Electronic Component
SMD Inductor
Electronic Component
±10%
Electronic Component
0.027g
Inductor
1.2uH
Electronic Component
1
Factor
35@10MHz
Electronic Component
BM0264913840
Current
25mA
Frequency
85MHz
Resistor(DCR)
800mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Sunlord SDFL1608P1R2KTF 贴片电感产品概述

Sunlord(顺络)SDFL1608P1R2KTF是一款专为低功耗、高频电路设计的0603封装贴片电感,凭借紧凑尺寸、稳定参数及低损耗特性,广泛应用于便携式电子、射频通信等领域。以下从多维度详细介绍该产品。

一、产品基本信息

  • 品牌与型号:顺络电子(Sunlord)出品,型号SDFL1608P1R2KTF。其中:
    • “1608”为公制封装尺寸(1.6mm×0.8mm),对应英制0603封装;
    • “1R2”表示电感值1.2μH;
    • “K”为精度标识(±10%);
    • “TF”为顺络常规封装系列标识。
  • 产品定位:小电流、高频贴片电感,适用于低功耗电路的滤波、信号调理,不支持大功率负载。

二、核心参数详解

该产品参数针对低功耗高频场景优化,关键指标如下:

  1. 电感值与精度:1.2μH±10%,覆盖大多数低功耗电路的滤波需求,精度范围满足工程偏差,无需额外匹配。
  2. 额定电流:25mA(直流),指电感持续工作时不发生饱和、电感值变化≤10%的最大电流,适配低功耗MCU、传感器等小电流电路。
  3. 直流电阻(DCR):800mΩ,即电感线圈的直流阻抗。实际损耗计算显示:当电流为25mA时,损耗仅为(I^2R=0.5mW),对低功耗系统效率影响极小。
  4. 品质因数(Q值):35@10MHz,Q值反映电感储能与损耗的比值((Q=2πfL/R))。35的Q值在10MHz频段表现优异,可有效减少信号损耗,提升射频电路信噪比。
  5. 自谐振频率(SRF):85MHz,当工作频率超过SRF时,电感因寄生电容呈容性。因此建议有效工作频率范围为10MHz~80MHz(避开SRF附近过渡区)。

三、封装与工艺特点

  1. 封装尺寸:0603(1.6mm×0.8mm×0.8mm),体积小巧,可大幅节省PCB板级空间,适配便携式电子设备的轻薄化需求。
  2. 制造工艺:采用顺络成熟的多层绕线工艺,确保批量生产时参数一致性——电感值偏差控制在±10%以内,DCR稳定性优于行业平均水平。
  3. 可靠性:支持标准回流焊工艺(温度范围符合IPC标准),工作温度范围为-40℃~+85℃,可满足消费电子及工业级场景的环境要求。

四、典型应用场景

该产品因小电流、高频特性,适用于以下场景:

  1. 射频前端电路:如低功率FM发射/接收、13.56MHz RFID低频段模块,利用高Q值减少信号损耗。
  2. 低功耗电源滤波:智能手环、蓝牙耳机的MCU电源滤波,或LED小功率驱动电路的纹波抑制,25mA电流完全匹配。
  3. 传感器接口电路:温度传感器、运动传感器的信号调理,电感用于过滤噪声,不影响低功耗传感器工作。
  4. 小型电子模块:智能手表辅助电路、智能家居控制模块,借助0603封装实现高密度布局。

五、性能优势总结

  1. 小封装高密度:0603封装适配轻薄化产品,满足消费电子趋势;
  2. 高频低损耗:Q值35@10MHz+DCR800mΩ,高频小电流场景下损耗极小;
  3. 参数稳定可靠:顺络品牌保障批量一致性,降低电路调试难度;
  4. 工艺兼容性强:支持标准SMT生产,可与其他贴片元件无缝兼容。

如需获取详细 datasheet 或选型建议,可参考顺络电子官方技术文档。该产品是低功耗高频电路设计的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.