Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunlord GZ1608D202TF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord GZ1608D202TF
- Type
- SUNLORD
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- GZ1608D202TF
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0264536482
- Operating Temperature
- 55℃~+125℃
- Current
- 100mA
- @Frequency
- 2kΩ@100MHz
- Resistor(DCR)
- 1.2Ω
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：GZ1608D202TF 磁珠
1. 产品简介
GZ1608D202TF是一款由顺络（Sunlord）公司生产的高性能磁珠，广泛应用于电子设备中的电源滤波和信号完整性保护。作为一种被动元器件，磁珠以其优异的阻抗特性和低直流电阻，成为各种电子电路中不可或缺的组成部分。它特别适合用于高频信号处理，以抑制电磁干扰（EMI）并改善信号质量。
2. 主要参数
- 商品分类：磁珠
- 标称阻抗@测试频率：2kΩ @ 100MHz
- 电路数：1
- 直流电阻（RDC）：1.2Ω
- 误差：±25%
- 额定电流：100mA
- 封装：0603（尺寸: 0.06×0.03英寸）
3. 技术特点
GZ1608D202TF的主要技术特点如下：
优异的阻抗特性：在100MHz的频率下，标称阻抗为2kΩ，可以有效抑制高频噪声，从而保障电路的稳定性和可靠性。这一特性使其非常适合用于RF（射频）应用和高速数字电路。
低直流电阻：直流电阻为1.2Ω，意味着在工作时能量损耗较低，这对于电源管理系统以及需长时间工作的电路尤为重要，能够提高系统的能效。
高额定电流：其额定电流为100mA，确保其在日常应用中的稳定性和安全性。能够在一定范围内满足多种电路需求，适应性强。
尺寸优化：0603封装使得GZ1608D202TF在占用空间的同时方便集成，适合现代小型化电子产品设计。
4. 应用领域
GZ1608D202TF磁珠广泛应用于多个领域，具体包括但不限于：
- 移动通信设备：如智能手机、平板电脑等，以抑制电磁干扰和提高信号质量。
- 消费电子产品：如电视机、音响设备等，保证音视频信号的高质量传输。
- 计算机及周边设备：在数据线及供电线中应用，提高数据传输的稳定性。
- 工业设备：在传感器和控制模块中用于抗干扰设计，以提高设备的可靠性。
5. 安装注意事项
在使用GZ1608D202TF磁珠时，需要注意以下几点：
- 焊接温度控制：应遵循制造商提供的焊接温度曲线，防止过高的温度导致元器件损伤。
- 避免过载：虽然其额定电流为100mA，然而建议在实际应用中对电流进行仔细考虑，尽量避免持续接近额定值，以延长元器件的使用寿命。
- 合理布局：在PCB设计中，磁珠的布局应尽量靠近需要滤波的电路，以提高滤波效果，并避免信号线长距离传播造成的干扰。
6. 总结
GZ1608D202TF磁珠以其优良的电气性能、紧凑的封装和广泛的应用领域，成为电子元器件市场上备受推崇的选择。无论是在高频电路的噪声抑制还是在信号完整性的维护中，GZ1608D202TF都能提供可靠的解决方案。随着电子技术的不断发展，其应用范围将不断扩大，继续为现代电子产品提供高效的噪声抑制和信号滤波支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
