WMSIC Electronic Components

Sunlord MWTC252010S1R0MT

ModelMWTC252010S1R0MT
PackageSMD,2.5x2.0x1.0mm
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord MWTC252010S1R0MT
Type
SMD, 2.5X2.0X1.0MM
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
MWTC252010S1R0MT
Electronic Component
1
Package
SMD,2.5x2.0x1.0mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.055g
Inductor
1uH
Electronic Component
1
Electronic Component
BM0258491140
Current
3.4A
Resistor(DCR)
38mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
4.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MWTC252010S1R0MT — Sunlord(顺络)功率电感产品概述

一、产品简介

MWTC252010S1R0MT 是顺络(Sunlord)推出的一款面向开关电源和功率滤波的贴片功率电感。标称电感值为 1.0 μH,公差 ±20%,适用于对体积与电流能力均有较高要求的电源设计。器件尺寸为 2.5 × 2.0 × 1.0 mm(1008 尺寸),属于 SMD 结构,便于自动贴装和高密度 PCB 布局。

二、主要电气参数

  • 电感值:1.0 μH ±20%
  • 额定电流(Irated):3.4 A(用于长期连续工作时的参考值)
  • 饱和电流(Isat):4.5 A(电感值下降至显著偏离额定值时的临界峰值)
  • 直流电阻(DCR):38 mΩ(典型,影响功耗与发热)
    这些参数决定了器件在高电流开关条件下的稳态与瞬态表现,是选型的关键依据。

三、特性与优点

  • 小尺寸高电流:1008 小型封装同时支持数安培级别电流,适合空间受限的电源模块。
  • 低 DCR:38 mΩ 的直流电阻有利于降低铜损,提高转换效率并减少温升。
  • 良好的饱和裕度:4.5 A 的 Isat 为峰值纹波电流和瞬态冲击提供保护边界。
  • SMD 可回流焊工艺友好,利于批量生产及自动化装配。

四、典型应用场景

  • 手机与便携设备的 DC-DC 降压模块(buck)
  • 工业与消费类电源模块的输入/输出滤波
  • LED 驱动与电池管理系统(BMS)中的功率滤波元件
  • 高密度电源板和模块化电源解决方案

五、使用与设计建议

  • 电流去衰(derating):长时间工作应以额定电流(3.4 A)为连续电流参考值,设计时留有裕量以控制温升与防止长期接近饱和;峰值脉冲可接近但不应长期超过 Isat(4.5 A)。
  • DC 偏置与感值下降:在较大直流偏置下电感值会下降,实际电感应以电路工作点下的测量或厂商曲线为准。
  • 布局与焊接:将电感置于开关节点附近,尽量缩短高电流回路的走线,保证足够的铜厚与宽度以降低寄生阻抗;遵循厂商的回流焊工艺建议,避免机械应力。
  • 热管理:关注周边元件发热与器件自身温升,必要时通过铜箔面积扩展或散热结构辅助散热。

六、选型与替代考量

在替换或比较时,优先匹配电感值、额定电流、饱和电流与 DCR 三项关键指标;同时比较封装尺寸与磁芯材料对频率特性与损耗的影响。如需更高电流能力或更低 DCR,可考虑更大封装或专用低损耗功率电感;若要求更严格的电感公差或频率特性,应参考顺络数据手册中的频率响应与温升曲线。

七、结语

MWTC252010S1R0MT 以小封装、高电流和较低 DCR 的组合,适合空间受限且要求较高电流承载的电源应用。推荐在实际设计中结合厂商数据手册的典型曲线(温升、感值随直流偏置变化、频率特性等)进行仿真与样机验证,以确保电路在目标工况下的可靠性与效率。

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