WMSIC Electronic Components

Sunlord GZ1608U151CTF

ModelGZ1608U151CTF
Package0603
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunlord GZ1608U151CTF
Type
SUNLORD
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
GZ1608U151CTF
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.027g
Electronic Component
1
Channel Count
1
Electronic Component
BM0265071908
Operating Temperature
55℃~+125℃
Current
500mA
@Frequency
150Ω@100MHz
Resistor(DCR)
250mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

顺络GZ1608U151CTF片式磁珠产品概述

一、产品定位与封装规格

顺络GZ1608U151CTF属于高频干扰抑制型片式磁珠,核心针对100MHz频段的电磁干扰(EMI)抑制设计,采用行业通用的1608(公制)/0603(英制)小型化封装(尺寸约1.6mm×0.8mm×0.8mm),适配高密度PCB布局需求,可直接表面贴装(SMT),兼容常规无铅回流焊工艺,生产兼容性强。该产品为单通道磁珠,无极性设计,安装无需区分方向,简化电路设计与生产流程。

二、核心电气参数详解

  1. 阻抗特性:标称阻抗为150Ω@100MHz,阻抗误差±25%。100MHz是电子设备中常见的射频干扰频段(如蓝牙、WiFi、无线通信的杂散干扰),该参数针对性强,可有效衰减此频段内的共模/差模干扰信号,提升电路抗干扰能力。
  2. 直流电阻(DCR):典型值250mΩ,属于低直流损耗设计。在电源滤波场景中,低DCR可减少电源路径的压降损耗,避免影响负载电路的直流供电稳定性,尤其适合对电源效率要求较高的小电流电路(如MCU、传感器供电)。
  3. 额定电流:持续工作额定电流为500mA,可满足多数小型电子电路的电源滤波需求。需注意:实际应用中应避免超过额定电流的持续工作,防止磁珠过热导致阻抗特性下降或失效。

三、典型应用场景

该磁珠因封装紧凑、参数适配性强,主要应用于以下场景:

  1. 消费电子领域:智能手机、平板电脑、智能穿戴设备的主板射频前端滤波(如WiFi模块、蓝牙天线回路)、电池供电模块噪声抑制。
  2. 工业控制设备:工业传感器(如温度、压力传感器)、PLC模块的电源滤波(宽温范围-55℃~+125℃适配工业环境温度波动)、信号传输线的干扰抑制。
  3. 通信设备:小型基站、无线AP的射频电路杂散干扰抑制(针对100MHz左右干扰频段)。
  4. 汽车电子(辅助类):车载小型传感器(如胎压监测、环境传感器)的电源滤波(温宽满足汽车环境-40℃~+85℃需求,需结合具体项目认证)。

四、环境适应性与可靠性

  1. 工作温度范围:-55℃~+125℃,覆盖工业级、汽车级(部分场景)的温度需求,可在极端环境下稳定工作,避免因温度变化导致阻抗特性漂移。
  2. 可靠性:采用顺络成熟的片式磁珠工艺,具备良好的耐焊接性(兼容无铅回流焊峰值温度260℃)、抗振动性(满足常规电子设备振动测试要求),长期工作稳定性可靠,无明显性能衰减。

五、选型与使用注意事项

  1. 频率匹配优先:该磁珠的有效阻抗集中在100MHz左右,若需抑制其他频段干扰(如50MHz、200MHz),需选择对应频率点的磁珠型号,避免盲目选型导致干扰抑制效果不佳。
  2. 电流余量确认:额定电流500mA为持续工作电流,若电路存在峰值电流(如瞬间启动电流),需计算峰值电流下的磁珠温升(通常建议温升不超过50℃),或选择更高额定电流的型号(如顺络同系列1A版本)。
  3. 封装兼容性:0603封装需匹配PCB焊盘尺寸(通常为0.8mm×1.2mm),确保焊接后无虚焊、假焊问题,影响电路可靠性。
  4. 并联/串联说明:若需提升阻抗或电流能力,可采用并联(提升电流)或串联(提升阻抗)方式,但需注意并联时的电流均分,避免局部过热。

该产品凭借小型化封装、精准的100MHz频段干扰抑制能力,成为消费电子、工业控制等领域的高性价比EMI解决方案,可有效解决电路中的电磁兼容问题。

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