WMSIC Electronic Components

Sunlord GZ1608D470TF

ModelGZ1608D470TF
Package0603
BrandSUNLORD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

18 specifications

Core information

Product name
Sunlord GZ1608D470TF
Type
SUNLORD
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUNLORD
Electronic Component
GZ1608D470TF
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.027g
Electronic Component
1
Channel Count
1
Electronic Component
BM0264536480
Operating Temperature
55℃~+125℃
@Frequency
47Ω@100MHz
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

顺络GZ1608D470TF 片式磁珠产品概述

顺络电子(Sunlord)推出的GZ1608D470TF是一款专为高频噪声抑制设计的片式磁珠,采用表面贴装工艺,适用于消费电子、汽车电子、工业控制等多领域的电路抗干扰需求。

一、产品基本定位

该磁珠属于顺络常规系列片式磁珠,核心作用是通过交流阻抗特性滤除电路中的射频干扰(RFI)和电磁干扰(EMI),同时保持直流信号的低损耗传输。产品型号中“1608”对应公制封装尺寸(1.6mm×0.8mm),“470”表示100MHz下阻抗为47Ω(“0”代表10⁰),“TF”为顺络内部工艺代码,标识产品的材料体系与性能等级。

二、核心电气性能参数

  1. 阻抗特性:额定频率100MHz下,交流阻抗为47Ω,误差范围±25%,可有效抑制100MHz频段附近的高频噪声;
  2. 直流特性:直流电阻(DCR)典型值≤2Ω(具体需参考官方 datasheet),保证直流信号传输时的低损耗,不会显著影响电路的直流工作点;
  3. 额定电流:常规0603封装磁珠的额定直流电流约为100mA(顺络该型号具体值需确认),过流时阻抗会随温度升高而下降,需避免超额定电流使用。

三、封装与机械特性

  • 封装类型:公制1608(英制0603),尺寸为1.6mm(长)×0.8mm(宽)×0.5mm(厚,典型值),符合国际电子封装标准;
  • 端电极结构:采用三层镀层设计(镍/铜/锡),适配无铅回流焊工艺,焊接可靠性高,可承受260℃峰值温度(回流焊时间≤10秒);
  • 机械强度:满足行业标准的振动(10~2000Hz,加速度1.5g)与冲击(1000m/s²,持续11ms)测试,适合批量贴片生产与恶劣环境应用。

四、环境适应性

该磁珠的工作温度范围为-55℃~+125℃,覆盖工业级与汽车级应用的温度需求:

  • 低温环境下(-55℃),阻抗特性稳定,无性能下降;
  • 高温环境下(+125℃),长期工作无老化失效,满足车载电子、户外工业设备的宽温要求;
  • 湿度适应性:可在相对湿度95%以下的环境中长期使用,存储条件为常温干燥环境(温度0~40℃,湿度≤60%)。

五、典型应用场景

  1. 消费电子:手机、平板、笔记本电脑的射频电路(WiFi、蓝牙、5G模块)滤波,抑制无线信号干扰;
  2. 汽车电子:车载通信系统(GPS、车联网)、传感器电路(胎压监测、摄像头)的EMI抑制,适配汽车级宽温要求;
  3. 工业控制:PLC、变频器、工业传感器的电源滤波与信号线路噪声抑制,提高设备抗干扰能力;
  4. 物联网设备:智能家电、可穿戴设备的无线模块抗干扰,保证数据传输稳定性。

六、选型与使用注意事项

  1. 频率匹配:需根据电路中需要抑制的噪声频率选择,该型号重点针对100MHz频段,若噪声频率偏离需选择对应阻抗的磁珠;
  2. 电流限制:避免超过额定直流电流(需确认官方 datasheet),防止阻抗下降影响滤波效果;
  3. 焊接工艺:采用无铅回流焊,禁止手工焊(易导致温度不均损伤元件),焊接后需检查端电极焊接完整性;
  4. 存储管理:开封后建议12个月内使用,未开封产品需密封保存,避免受潮影响焊接性能。

该产品凭借宽温特性、稳定的阻抗性能与小型化封装,成为多领域电路抗干扰设计的常用元件,具体参数需以顺络官方发布的 datasheet 为准。

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