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Sunlord MWTC252010S100MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunlord MWTC252010S100MT
- Type
- SUNLORD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUNLORD
- Electronic Component
- MWTC252010S100MT
- Electronic Component
- 1
- Package
- 1008
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.052g
- Inductor
- 10uH
- Electronic Component
- 1
- Electronic Component
- BM0264913864
- Current
- 1.2A
- Resistor(DCR)
- 360mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- and Current(Isat)
- 1.5A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MWTC252010S100MT 产品概述
一、产品简介
MWTC252010S100MT 为一体成型功率电感，标称电感值 10 μH，精度 ±20%。器件采用紧凑封装设计（1008 尺寸），结构稳定、耐振动，适合表面贴装工艺。该系列由顺络类产品参数参考，面向中小电流电源滤波与储能场合。
二、主要参数
- 电感值：10 μH（±20%）
- 额定电流：1.2 A（连续工作电流，热限值）
- 饱和电流 Isat：1.5 A（在规定偏置条件下电感显著下降的起始值）
- 直流电阻 DCR：约 360 mΩ（标称，说明书项下也有 420 mΩ 的标注，具体以厂商出具的规格书为准）
- 描述：一体成型电感，封装 1008，品牌示例：Sunlord（顺络）
三、产品特点
- 紧凑体积：1008 小封装，适合空间受限的便携与板上应用。
- 良好电流承载能力：1.2 A 额定电流配合 1.5 A 饱和电流，能满足中低功率点对点稳压与升降压转换器的需求。
- 一体成型：外观一致、机械强度高，便于贴片机装配与自动化生产。
- 可靠性高：结构封装降低外界湿气与振动影响，适合车规等对机械稳定性有一定要求的应用（请按具体型号规格书确认）。
四、典型应用
- 移动终端与便携设备电源滤波（DC-DC 输出侧/输入侧滤波）
- 中低功率升压/降压转换器（功率级储能）
- LED 驱动与背光电源滤波
- 工业控制模块的滤波与电流供给隔离
五、设计与使用建议
- 电流余量：建议使用时预留一定余量（例如 20% 或以上），避免长期在额定电流附近工作导致温升和性能退化。
- 饱和裕量：选择时应考虑 Isat，在负载可能出现短时峰值电流的场合预留足够裕度，避免电感值急剧下降影响电路工作。
- 温升与布局：DCR 较高时（数百 mΩ）会产生可观的 I^2R 损耗，布局时应保证散热条件，走线尽量宽短，靠近电源开关器件放置以减小环路面积。
- 测试条件：饱和电流与电感量随频率、温度变化，建议在目标工作条件下实测确认。
六、封装与焊接
- 封装类型适用于自动贴装和回流焊工艺；常见回流温度曲线（按行业标准）适用，但具体回流档位请以供应商的焊接说明为准。
- 损伤防护：避免强力挤压、机械冲击与长时间高温存放；贴装前保持干燥箱条件以防水汽吸收（如为潮湿敏感器件则遵循 MSL 要求）。
七、注意事项与选型建议
- 参数核对：注意规格书中 DCR、Isat 的测试方法与条件差异（不同测定准则会导致数值偏差）。
- 替代选型：若需要更低损耗可选取 DCR 更低、尺寸更大的器件；若空间允许，可选择更高 Isat 的型号以应对瞬态大电流。
- 采购与样测：建议向供应商索取完整规格书与样品，在目标应用环境（温度、频率、负载）下进行温升、效率与稳定性验证后再量产替换。
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