WMSIC Electronic Components

SGMICRO SGM3752YTN6G/TR SGM3752YTN6G

ModelSGM3752YTN6G/TR
PackageTSOT-23-6
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SGMICRO SGM3752YTN6G / TR
Type
SGMICRO
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM3752YTN6G/TR
Electronic Component
1
Package
TSOT-23-6
Type
DC-DC
Electronic Component
LEDDriver
Electronic Component
PWM
Electronic Component
0.052g
Electronic Component
1
Features
Built-in; LED; (OTP)
Electronic Component
BM69415084
Operating Temperature
40℃~+85℃
Switching Frequency
1.2MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM3752YTN6G/TR 产品概述

一、产品简介

SGM3752YTN6G/TR 是由中国知名半导体公司 SGMICRO(圣邦微)推出的一款集成电源管理IC,属于其电源管理产品系列。该IC专为便携式电子设备而设计,采用小巧的TSOT-23-6封装,适合于空间有限的应用。SGM3752提供高效的电源管理解决方案,具有低功耗和高性能的特点。

二、主要特点

  1. 供电范围广:SGM3752支持宽范围的输入电压,能够适应不同的电源需求,使得其能够在多种应用场景下表现良好。

  2. 高集成度:集成了多个功能模块,包括电压调节和保护电路,减少了外部元器件的需求,从而使得电路设计更加简洁。

  3. 低静态功耗:SGM3752在待机状态下也保持极低的能耗,适合对电池续航有高要求的设备。

  4. 过压和过流保护:内置的保护机制能够在过电压和过电流的情况下自动切断电源,保障电路的安全性和可靠性。

  5. 快速响应:该IC具有优良的瞬态响应能力,能够快速适应负载变化,确保输出电压的稳定性。

  6. 温度特性稳定:SGM3752经过严格的温度测试,保证在不同环境温度下都能稳定工作。

三、封装与引脚配置

SGM3752采用TSOT-23-6封装,这种封装形式具有小体积、短引脚、轻便等优点,非常适合体积紧凑的电子产品。该封装的引脚配置合理,便于PCB布局与焊接,同时也具备良好的散热性能。

四、应用场景

SGM3752主要针对以下应用领域:

  1. 便携式电子设备:如智能手机、平板电脑、便携式音响等,能有效延长电池使用时间。

  2. 消费类电子产品:照相机、手表及其他需高效电源管理的消费类产品。

  3. 工业控制:在各种工业设备中,可用作电源管理的关键部件,保障设备稳定运行。

  4. 物联网设备:随着物联网的普及,SGM3752在各类传感器与监控设备中也展现了其优势。

五、设计建议

在使用SGM3752设计电路时,建议注意以下几点:

  1. 输入电源设计:确保输入电压范围在IC的工作范围内,避免过压损坏。

  2. 布局优化:由于该IC高集成度特性,在PCB布局时保持流线型设计,尽量缩短高频信号路径,以减少电磁干扰。

  3. 散热设计:尽管SGM3752具有较低的功耗,但在高负载情况下,仍需合理设计散热措施,确保其工作在安全温度范围内。

  4. 测试和验证:在产品研发阶段,通过原型测试与环境适应性验证,确保电路在各种真实工作情况下的稳定性。

六、总结

SGM3752YTN6G/TR 是一款集成度高、性能卓越的电源管理IC,具备多种保护功能和优异的电源转换效率,广泛适用于各类便携式电子产品及消费类电子设备。凭借其小巧的封装和强大的功能特性,使得设计师能够在设计过程中节省空间,同时提升整体设计的可靠性与稳定性。作为一个值得信赖的电源管理解决方案,SGM3752的推出无疑将助力于电子科技的进一步发展与革新。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.