WMSIC Electronic Components

SGMICRO SGM803-TXN3L/TR SGM803

ModelSGM803-TXN3L/TR
PackageSOT-23-3
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SGMICRO SGM803-TXN3L / TR
Type
SGMICRO
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM803-TXN3L/TR
Electronic Component
1
Package
SOT-23-3
Electronic Component
Supervisorand positions IC
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0000001611
Reset
240ms
Operating Temperature
40℃~+125℃
Operating Voltage
1V~5.5V
ICType
Voltage Supervisor
Output Type
Electronic Component
Voltage
3.08V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM803-TXN3L/TR 产品概述

一、产品简介

SGM803-TXN3L/TR 是一款由圣邦微(SGMICRO)生产的监控和复位芯片,采用 SOT-23-3 封装。该芯片设计用于在电源电压下降或故障时进行系统监控和复位,具有开漏输出和低电平有效的特性,使其非常适合多种电子设备中断电源的保护。SGM803 的规格参数确保了其在各类应用中的稳定性与可靠性。

二、产品特点

  1. 工作电压:SGM803 设计为在 3.08V 旁路下工作,确保与常见的低压电子设备兼容,特别适用移动电子、嵌入式系统及便携式设备中。

  2. 开漏输出:本芯片采用开漏输出方式,当监测到电源电压低于设定阈值时,输出端将被拉低,从而可以驱动外部电路的复位操作或其他相关功能。

  3. 低电平有效设计:该监控芯片的低电平有效特性使得其更易于与各种数字电路兼容,同时简化了系统设计,减少了在与其他电路交互过程中的复杂性。

  4. 小巧封装:SOT-23-3 的封装设计使得其在占用空间方面极具优势,特别适合体积要求较小的电子设备,从而提高了产品的设计灵活性。

  5. 宽工作温度范围:SGM803 具有宽广的工作温度范围,能够在不同环境条件下稳定运行,适应性更强,确保在极端条件下也能提供可靠的监控和复位功能。

三、应用场景

SGM803-TXN3L/TR 的应用领域广泛,主要包括但不限于以下几个方面:

  1. 电源管理:在电子设备中提供电源监控和过电压/欠电压保护,保证稳定供电。

  2. 嵌入式系统:适用于微处理器或微控制器系统中的复位管理,确保在电压下降时有效地复位系统,防止系统不稳定或损坏。

  3. 消费类电子:可用于智能手机、平板电脑、音视频播放器等消费者设备中,保护电池和电源电路。

  4. 工业控制:在工业自动化设备中,强大的监控功能有助于及时发现潜在电源故障,保障设备正常运行。

  5. 汽车应用:在汽车电子系统中,SGM803 可以用于监控电源,确保电子设备的安全和稳定性。

四、性能指标

SGM803 的主要性能指标如下:

  • 工作电源电压:3.08V
  • 工作环境温度范围:-40°C 至 +85°C
  • 封装类型:SOT-23-3
  • 输出类型:开漏,低电平有效
  • 电源消耗:极低,适用于电池供电系统。

五、总结

SGM803-TXN3L/TR 是一款性能优越的监控和复位芯片,以其低电压、电源管理能力及小巧的封装设计,成为工业及消费类电子产品中不可或缺的组件。通过其可靠的输出特性,确保设备在电压下降的情况下能够进行及时的复位,进而提高产品的安全性和稳定性。无论是在设计新产品还是在现有系统中增加监控功能,SGM803 都是一个理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.