WMSIC Electronic Components

SGMICRO SGM706-TYS8G/TR SGM706

ModelSGM706-TYS8G/TR
PackageSOP8
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SGMICRO SGM706-TYS8G / TR
Type
SGMICRO
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SGMICRO
Electronic Component
SGM706-TYS8G/TR
Electronic Component
1
Package
SOP8
Electronic Component
Supervisorand positions IC
Electronic Component
0.167g
Electronic Component
1
Features
positions; Gate
Electronic Component
BM0093065410
Reset
200ms
Operating Temperature
40℃~+85℃
Operating Voltage
1V~5.5V
ICType
Voltage Supervisor
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM706-TYS8G/TR 产品概述

SGM706-TYS8G/TR 是由中国知名品牌圣邦微(SGMICRO)推出的一款高性能监控和复位芯片。该芯片采用 SOIC-8 封装,尺寸小巧,便于集成到各种电子设备中。SGM706 主要应用于电源管理领域,尤其是在需要实时监控电压水平以及实现系统复位功能的场合,具备广泛的应用潜力。

主要功能与特性

  1. 电压监控:SGM706-TYS8G/TR 可用于监控系统电压,当电压低于设定值时,芯片会立即检测到这一变化。这一功能对于保护微处理器和其他敏感电子元件至关重要,可以防止因电压低导致的工作不稳定或损坏。

  2. 复位功能:在电压低于特定阈值时,SGM706 能够输出复位信号,确保系统在电压恢复到正常水平之前不进行操作,避免在电压不稳定情况下启动或执行错误命令。这不仅提升了系统的可靠性,还可以延长设备的使用寿命。

  3. 多种电压阈值选择:SGM706 系列芯片提供多种电压监控的阈值选择,可以满足不同应用场景对电压的不同要求,用户能够根据具体设计放置适合的阈值,以最佳配置实现设计目标。

  4. 快速响应时间:SGM706 具备快速的监控与复位响应时间,能够及时地反映电源状态变化,确保系统能够快速恢复到稳定的工作状态。

  5. 低功耗特性:该芯片在工作中表现出良好的低功耗特性,适合于便携式和低功耗设备,有助于提升整机效率,并且延长电池使用寿命。

  6. 小型封装:SOIC-8 封装设计使其适合多种空间有限的应用场景,有助于在小型化设计中实现高效率的电源管理。

应用场景

SGM706-TYS8G/TR 被广泛应用于各种电子设备中,特别是在需要电压监控和复位的以下行业和应用场景:

  • 消费电子产品:如智能手机、平板电脑和家用电器,这些产品常常需要精确的电压管理和稳定的复位功能以防止在电源波动时出现故障。

  • 工业设备:在工业控制系统和自动化设备中,SGM706 确保设备在电力供应稳定的情况下安全运行,减少因电压波动引起的操作错误。

  • 汽车电子:随着汽车电子技术的不断发展,SGM706 被广泛应用于汽车电子控制单元(ECU),提供稳定的电源监控与复位功能,增强汽车电子系统的性能和安全性。

  • 通讯设备:在网络交换机、路由器和其他通讯设备中,SGM706 的高可靠性能够降低因电源问题造成的信号中断,提高用户体验。

总结

SGM706-TYS8G/TR 是一款功能丰富的监控与复位芯片,其在电源管理和系统保护方面的出色表现,使其成为各种电子设备中不可或缺的组成部分。随着技术的进步和市场需求的不断变化,SGM706 的应用将更加广泛,为更多产品提供可靠的电压监控和复位解决方案。其小型化、低功耗和高效率的特点,使其在现代电子设计中占据了重要的地位。选择 SGM706-TYS8G/TR,您将为项目增添强大的电源管理能力,确保系统的稳定性与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.