WMSIC Electronic Components

SGMICRO SGM2033-2.8XN5G/TR SGM2033

ModelSGM2033-2.8XN5G/TR
PackageSOT-23-5
BrandSGMICRO
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SGMICRO SGM2033-2.8XN5G / TR
Type
SOT-23-5
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
265mV@(250mA)
Electronic Component
SGMICRO
Electronic Component
26uVrms
Electronic Component
SGM2033-2.8XN5G/TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.041g
Electronic Component
1
Features
Output
Electronic Component
BM0227684633
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
2.8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2033-2.8XN5G/TR 产品概述

一、主要参数与特点

SGM2033-2.8XN5G/TR 是圣邦微(SGMICRO)推出的一款固定输出低压差线性稳压器(LDO),输出电压为 2.8V,面向对噪声与电源抑制有较高要求的便携与工业应用。主要规格如下:

  • 输出类型:固定(2.8V)
  • 最大输出电流:250 mA
  • 工作电压(输入):最高 5.5 V
  • 压差(Dropout):265 mV @ 250 mA
  • 静态电流(Iq):22 μA(极低静态消耗,利于电池供电)
  • 噪声:26 μVrms(低噪声设计)
  • 电源纹波抑制比(PSRR):94 dB @ 1 kHz(高频抑制能力强)
  • 保护功能:短路保护、热关断
  • 工作结温:-40 ℃ 至 +125 ℃ (Tj)
  • 封装:SOT-23-5,单通道,正输出极性

二、性能优势

  • 低压差:265 mV 的压差在 250 mA 输出时仍保持较低,可在输入电压接近输出电压的应用中提供稳定供电,延长电池使用时间或降低供电轨需求。
  • 超低静态电流:22 μA 的静态电流非常适合待机与低功耗场景,能显著降低系统静态耗电。
  • 低噪声与高 PSRR:26 μVrms 的噪声和 1 kHz 时 94 dB 的 PSRR,使该器件适合驱动 ADC、DAC、RF 前端、传感器及其他对电源噪声敏感的电路。
  • 完整保护机制:内置短路保护与热关断,当发生过流或温度过高时自动限制输出,提高系统可靠性与安全性。

三、典型应用场景

  • 便携式设备与电池供电系统(智能手表、手持终端、便携仪器)
  • 物联网节点、无线通信模块(需要低噪声、良好电源抑制的 RF/射频子系统)
  • 精密模拟电路(传感器供电、低噪声参考电源、数据采集系统)
  • 工业控制与嵌入式系统(要求宽温范围与过载保护)

四、设计与使用注意事项

  • 输入/输出去耦:为保证稳定性与最佳噪声性能,建议在输入与输出端放置低 ESR 的陶瓷电容(如 1 µF 以上),电容尽量靠近芯片引脚布局。
  • 散热与功耗管理:器件耗散功率为 (Vin - Vout) × Iout。在高 Vin 或满载条件下需考虑 PCB 散热设计(加大铜箔面积或使用散热过孔),以避免触发热关断并确保长期可靠性。
  • 布局建议:将 LDO 放置于受控电源区域,输入走线短且宽,输出走线单独回流到负载,地线布线良好以减少噪声耦合。若用于 RF 或精密模拟前端,尽量隔离数字噪声源。
  • 保护与测试:在系统集成阶段,应进行短路、过温与启动/关断顺序测试,验证在极端工况下保护电路动作正常且系统稳定。

五、封装与采购信息

  • 品牌:SGMICRO(圣邦微)
  • 型号:SGM2033-2.8XN5G/TR
  • 封装:SOT-23-5,便于表面贴装与小尺寸布局
  • 单通道、固定输出,适合空间受限且要求可靠性的电子产品设计

总结:SGM2033-2.8XN5G/TR 以其低压差、低静态电流、低噪声与高 PSRR 的组合特性,以及必要的短路/热保护,适合对电源品质与功耗有严格要求的便携与工业应用。在实际设计中注意滤波电容与散热布局,可充分发挥该器件的性能优势。

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