Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SGMICRO SGM811-RXKA4/TR SGM811
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SGMICRO SGM811-RXKA4 / TR
- Type
- SGMICRO
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SGMICRO
- Electronic Component
- SGM811-RXKA4/TR
- Electronic Component
- 1
- Package
- SOT-143
- Electronic Component
- Supervisorand positions IC
- Electronic Component
- 0.051g
- Electronic Component
- 1
- Features
- positions
- Electronic Component
- BM0000002679
- Reset
- 240ms
- Operating Temperature
- 40℃~+125℃@(TA)
- Operating Voltage
- 1V~5.5V
- ICType
- Voltage Supervisor
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SGM811-RXKA4/TR 产品概述
一、产品简介
SGM811-RXKA4/TR 是由著名的电子元器件制造商 SGMICRO（圣邦微）推出的一款监控和复位芯片。该芯片专为微控制器和其他数字电路提供电源监控和复位功能，确保系统可靠性与稳定性。它采用 SOT-143 封装，体积小巧，适合空间受限的应用场景。
二、技术特性
低电平有效监控：SGM811-RXKA4/TR 采用低电平有效的监控方式，这意味着当电源电压低于设定阈值时，芯片会输出低电平信号，从而触发复位状态。这种设计能够在不稳定的电源状态下保护连接的设备，防止因电源不稳定而导致的误操作或系统崩溃。
电压监控阈值：该芯片具有阈值电压为 2.63V 的监控电路。这一参数对于大部分低功耗电子设备而言是极为重要的，能够确保在低于此电压时，系统能够及时复位，防止系统损坏或数据丢失。
小型化封装：SGM811-RXKA4/TR 采用 SOT-143 封装，尺寸仅为 2.9mm x 3mm，非常适合小尺寸设备的设计需求。其小巧的外形能够有效节省PCB空间，方便设计师进行布线和布局。
高可靠性：该芯片具备高耐压性和良好的温度特性，在各种恶劣工况下均能稳定工作，确保系统的长期可靠性。同时，SGMICRO 提供的高品质保障也为其性能提供了有力支撑。
三、应用领域
SGM811-RXKA4/TR 被广泛应用于以下领域：
- 消费电子：如智能家居设备、智能手机和可穿戴设备。电源监控和复位功能能够确保设备在低电压情况下正常工作。
- 工业控制：在工业设备和自动化系统中，稳定的电源对于操作的安全至关重要，该芯片能够有效监控电源状态，防止设备故障。
- 汽车电子：在汽车电子系统中，电源波动可能会影响系统的稳定性，SGM811-RXKA4/TR 能够确保安全复位，有效提升汽车电子安全性。
- 网络通信设备：网络设备在运行过程中对电源质量有着较高的要求，确保数据传输稳定可靠，SGM811 的监控和复位功能正好满足这一需求。
四、设计建议
在设计基于 SGM811-RXKA4/TR 的电路时，需要考虑以下几点：
- 布局设计：由于该芯片对电源质量敏感，建议尽量缩短输入电源引脚和地引脚的连接线，以减少电磁干扰的影响。
- 旁路电容的使用：在 VCC 和地之间添加一个适当值的旁路电容，可以有效滤除电源噪声，提高芯片的稳定性。
- 评估复位时间：根据所选应用的需求，可以通过外部电阻和电容的配置来调整复位时间，以便满足具体项目的要求。
五、总结
SGM811-RXKA4/TR 是一款高度稳定且可扩展的监控和复位芯片，适用于多种低电压监控应用。凭借其低电平有效、高可靠性和小型化的优势，广泛应用于消费电子、工业控制、汽车电子和网络通信设备中。合理的设计和布局将帮助设计师充分发挥 SGM811 的优良性能，为最终产品提供卓越的稳定性和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
