Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SGMICRO SGM2036-1.8YN5G/TR SGM2036
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SGMICRO SGM2036-1.8YN5G / TR
- Type
- SGMICRO
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SGMICRO
- Electronic Component
- 100uVrms
- Electronic Component
- SGM2036-1.8YN5G/TR
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Features
- Terminal Block; Output
- Electronic Component
- BM0000287256
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 5.5V
- Output
- Electronic Component
- Output Voltage
- 1.8V
- Output Current
- 300mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SGM2036-1.8YN5G/TR 产品概述
概述
SGM2036-1.8YN5G/TR 是由知名电子元器件制造商 SGMICRO（圣邦微）推出的一款电源集成电路（IC），主要提供稳定的1.8V输出电压和300mA的电流驱动能力。该元器件采用 SOT-23-5 封装，适合应用于空间受限的便携式设备、传感器及各种电子产品。
产品特性
稳定的输出电压：SGM2036-1.8YN5G/TR 设计用于提供极为稳定的1.8V输出电压，能够有效支持多种需要低电压供电的电子电路。
高输出电流：在300mA的输出电流范围内，该电源IC能够满足大部分低功耗应用的需求，如无线传输设备、便携式音频设备和低功耗微控制器的供电。
高效率：SGM2036 采用先进的电源管理技术，能够在较宽的负载范围内保持高效率，这使其在电源管理方案中成为一个理想选择，有效延长产品的电池使用时间。
小型封装：SOT-23-5 封装设计使得 SGN2036-1.8YN5G/TR 具有非常小的尺寸，易于在空间有限的电路板上进行安装。同时，该封装也支持高密度的成品设计。
过流和过热保护：该电源IC内置过流保护和过热保护功能，确保在异常工作条件下，电路不会受到损坏，从而提高了系统的可靠性。
应用场景
SGM2036-1.8YN5G/TR 适用于多种现代电子产品，主要包括但不限于以下几种应用场景：
便携式电子设备：如智能手机、手持式游戏机等需要低电压供电的便携产品，SGM2036-1.8YN5G/TR 能够为其提供稳定的电源。
传感器供电：在物联网（IoT）领域，许多小型传感器和执行器需要稳定的低电压电源，SGM2036-1.8YN5G/TR 完美满足了这一需求。
微控制器应用：微控制器对电源的稳定性要求较高，该电源IC能够为广泛的MCU和处理器提供无噪声的电源，保证其稳定运行。
无线通信模块：在许多无线通信模块中，稳定和高效的电源管理至关重要，SGM2036-1.8YN5G/TR 能够有效支持它们的功能。
技术参数
- 输入电压范围：通常为2.5V至5.5V，适合各种常用电源。
- 工作温度范围：-40℃至+125℃，适应各种环境条件。
- 输出电压：稳定输出1.8V，适合多种低电压应用。
- 输出电流能力：最大300mA，满足一般应用需求。
- 封装：SOT-23-5，有助于缩小电路板尺寸。
总结
SGM2036-1.8YN5G/TR 是一款功能强大的电源IC，凭借其稳定的输出电压、高效率、小型封装和多重保护特性，成为现代电子设备的理想选择。无论是在便携式设备、传感器应用还是无线通信模块中，SGM2036-1.8YN5G/TR 都能展现出其卓越的性能。随着电子产品对电源管理要求的日益增加，SGM2036-1.8YN5G/TR 不仅能满足当前的市场需求，还将推动未来技术的发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
